Assembly and Packaging
- ASYNTIS - Remote Plasma Etch Solutions for Thin Wafer Stress Relief, Surface Conditioning and Passivation
- Pac Tech - Wafer Bumping, Based on Electroless Nickel Plating, and Laser Wafer Bonding
- STS - Dry Etch and Deposition Processes for Advanced Packaging Applications
- Unisem - Package Design, Bump Fab, Wafer Probing, Wafer Grinding, Design for Test, Assembly, Final Test, Packaging and Testing of IC's, Tape and Reel
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