ASYNTIS - Remote Plasma Etch Solutions for Thin Wafer Stress Relief, Surface Conditioning and Passivation

ASYNTIS develops, assembles, and markets turnkey plasma etch equipment for thin wafer manufacturing and related semiconductor areas.

Based on superior plasma technology and solid process experience, ASYNTIS offers unique process tools and solutions that boost product throughput and yield by unmatched process speed and cool process temperatures. ASYNTIS's customers benefit from rapid ROIC and technological advantages. ASYNTIS is dedicated to expanding its plasma technology solutions along the semiconductor value chain.

REMOTE PLASMA PROCESS - NUMEROUS SOLUTIONS TO THIN WAFER MANUFACTURING CHALLENGES

ASYNTIS uses a unique remote plasma source, which allows low process temperatures and high throughput. For the first time, plasma etch meets the industrial requirements of process performance and quality for a wide range of high volume applications. The technical and manufacturing challenges that ASYNTIS solutions address include ultra-thin wafer and die strength enhancement and repair, warped wafer handling, backside die chipping and cracking, yield loss, thin wafer packaging issues such as the 'popcorn' effect, sharp wafer edges, and die marking issues.

Solutions for these technical and manufacturing problems include but are not limited to the following:

• Removes mechanical stress induced by grinding
• Increases yield - wafer level and die level
• Selectable custom wafer surface and conditioning - shiny surface quality or matt finish as needed
• Improves adhesion
• Higher dicing quality
• Better die flexibility
• Universal bridge tools for 300mm and 200mm wafer processing

NEW SILICON STAR 12 SYSTEMS AUTOMATES 300MM WAFER STRESS RELIEF

ASYNTIS is proud to announce the introduction of the Silicon Star 12 - a fully automated 300mm wafer remote plasma system that supports all the ASYNTIS thin-wafer manufacturing processes. The fully automated Silicon Star 12 compliments the existing semiconductor system product line including the Silicon Star 8 (for 200mm and 150mm wafer processing), the Silicon Star 8M and 12M (manual tools), and the integrated OEM solutions for both 200mm and 300mm wafer processing.

This standalone system is an excellent solution for manufacturing facilities currently in the mode of processing both 300mm and 200mm wafers, as the tool is a true bridge tool that can be converted in minimal time between wafer sizes. In addition, although the Silicon Star 12 is a standalone unit, it has been designed to facilitate integration with a production grinder. Hence the production robot would serve the cassette, the plasma chamber and a production grinder.

LEADING SOLAR CELL SOLUTIONS

In addition to semiconductor related solutions, ASYNTIS also provides leading edge solutions for the manufacturing of solar cell products. The compact manual dry etch system Pioneer No.1 offers users a variety of etch applications in the field of silicon etching. The external arrangement of the radical source enables the processing of different substrate sizes and geometries at stable process conditions.

Typical applications are edge isolation in the solar cell industry, damage removal in diode manufacturing or the removal of sacrificial silicon layers. The low process temperatures simplify the handling of substrates significantly.

Therefore, the Pioneer No.1 offers a very cost effective solution of silicon etching at high etch rates and low process temperatures for a wide range of applications.

Highlights include:

• Etch rates in excess of 6um/min
• Process Temperatures below 80° C