Assembly and Packaging
ASYNTIS-Remote Plasma Etch Solutions for Thin Wafer Stress Relief, Surface Conditioning and Passivation | ||
 The Pioneer Number 1 is ASYNTIS's solution for solar cell plasma etch applications. |
 Through the use of ASYNTIS's revolutionary plasma stress relief solution, fragile, brittle wafers become flexible, strong, cool and relaxed. |
 Key to the success of ASYNTIS's processes is the remote plasma source. |
 The ASYNTIS handling robot operates fast and efficiently enabling high-quality, high-throughput operations to deliver value to thin-wafer manufacturing. |
 The Dual chamber Silicon Star 8 (fully automated) is the volume production solution for thin-wafer manufacturing. The tool delivers Stellar stress relief, surface conditioning, and passivation capabilities with industry-leading CoO. |
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Pac Tech-Wafer Bumping, Based on Electroless Nickel Plating, and Laser Wafer Bonding | ||
 Pac Tech GmbH is the world's leading wafer bumping and packaging subcontractor based on electroless nickel plating. |
 Pac Tech offers subcontractor wafer bumping for flip-chip and CSP (Chip Scale Package) technology. |
 Pac Tech's wafer bumping service concentrates on a low-cost electroless bumping process on wafer level, based on Ni/Au as an under bump metallization and solder application by stencil printing or solder ball bumping. |
STS-Dry Etch and Deposition Processes for Advanced Packaging Applications | ||
 MultiplexPro CVD used for deposition of sealing, encapsulation, refill, or passivation layers in packaging applications. |
 MACSPro ASEHRM for high rate deep silicon etching. |
 Through-wafer interconnects etched using STS' ASE® Process. |
 Sloped silicon profile etched using STS' ICP equipment (Courtesy of Shellcase). |
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Unisem-Package Design, Bump Fab, Wafer Probing, Wafer Grinding, Design for Test, Assembly, Final Test, Packaging and Testing of IC's, Tape and Reel | ||
 Malaysia-based Unisem is a leading turnkey assembly and test subcontract service provider for the semiconductor industry. |
 Unisem’s manufacturing services include wafer test, wafer probing, wafer bumping, flip chips and final tests. |
 Unisem offers a wide range of copper lead frame packaging products having various pin counts. The range includes PDIP, SOIC, PLCC, QSOP, SSOP, MSOP, TSSOP, SOT, SC70, TO and SLP (QFN). |
 Unisem provides various turnkey solutions covering package design, wafer probing, wafer bumping, wafer grinding, design for test, assembly, final test, packaging and testing of ICs, tape and reel, and direct shipments. |
 Unisem is equipped with state-of-the-art test systems that include Teradune Catalyst-RF, Intefra-Flex, J750 and Credence ASL3000-RF and ASL1000. |
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