STS - Dry Etch and Deposition Processes for Advanced Packaging Applications

Surface Technology Systems plc (STS) designs and manufactures dry etch and deposition equipment used in the production of semiconductor related devices, within:

• Packaging
• MEMS
• Photonics
• Compound Semiconductors

STS has strong presence in each of its served markets and distributes its machines worldwide through an experienced sales and service operation consisting of direct sales, distributors and agents. The Group currently markets in over 30 countries and has an installed base of approximately 800 machines with customers.

PLASMA PROCESSING FOR PACKAGING APPLICATIONS

STS works closely with a number of its customers, providing enabling process solutions to the device packaging challenges faced by manufacturers, such as reducing chip size and cost per die.

DEEP SILICON ETCH FOR THROUGH-WAFER INTERCONNECTS

STS is a market leader in high rate deep silicon etching with its Advanced Silicon Etch (ASE®) Process, which offers etch rates up to 20µm/min. Originating from the 'Bosch' DRIE Process, STS' ASE® Process offers additional patent-protected enhancements for Silicon on Insulator (SOI) processing, and 'Parameter Ramping' for optimized profile control of high aspect ratio features. This enables deep through-wafer interconnects used in wafer stacking for increasing packing density, reducing chip size.

CONTROLLED PROFILE SILICON ETCH

The processing parameters of STS' ICP technology can be manipulated to control the profile of etched features. This capability is being used by their customers for etching positively sloped trenches into the back-side of a silicon wafer for wafer level chip-scale packaging.

SACRIFICIAL LAYER ETCH

STS offers dry chemical vapour etch equipment for removing sacrificial layers, to free moving device structures within packaged devices prior to sealing. The plasma-less, isotropic etch processes offer high selectivities and low damage, with no stiction of device components often experienced with alternative wet etch solutions. STS, in conjunction with experienced partners can supply either XeF² vapour etch systems for silicon or HF vapour etch systems for SiO² removal.

PLASMA ENHANCED CHEMICAL VAPOUR DEPOSITION

More than 200 STS PECVD systems are installed worldwide, used to deposit a wide range of inorganic and organic films. In packaging applications PECVD is used to deposit sealing, encapsulation, refill, or passivation layers. STS' PECVD system offers deposition of high uniformity films at low temperature and pressure avoiding device damage.

PLATFORM OPTIONS

STS offers all its process technologies on a choice of 3 platforms designed to enable easy upgrade and transition from R&D to full scale production:

• MultiplexPro - Single chamber, manual loadlock with carousel option for up to 4 wafers, for R&D or small wafer volume applications
• MACSPro - MultiplexPro Atmospheric Cassette System, which is an upgrade to the MultiplexPro, allowing up 2 cassettes (50 wafers) to be processed automatically using robotic transfer. Suitable for increasing throughput from R&D to pilot production
• ASPECTPro - Cluster system which can configured with up to 4 process chambers and 2 vacuum cassette loadlocks, with fully automatic robotic wafer handling, suitable for full scale production applications