Unisem - Package Design, Bump Fab, Wafer Probing, Wafer Grinding, Design for Test, Assembly, Final Test, Packaging and Testing of IC's, Tape and Reel

Unisem (M) Berhad, is a Malaysian-based provider of manufacturing solutions to integrated circuit companies, specialised in assembly and testing for semiconductor devices. The company has the capability of packaging and testing a wide range of leadframe and substrate packages.

Unisem and its wholly-owned subsidiary Unisem (Europe) Limited provide turnkey solutions including package design, wafer probing, wafer grinding, design for test, assembly, final test, wafer test, wafer bumping, packaging and testing of ICs, tape and reel, besides direct shipments to customers worldwide.

The company is eyeing the growing semiconductor demand in China and has invested about US $25 millon in its proposed plant in Chengdu. Currently, potential clients are doing qualification tests at the plant, and the plant is on track for completion. Furthermore with the development of a brand new state-of-the-art facility, Unisem is assured of its position as a key player in the Semiconductor industry.

TURNKEY SERVICES FOR DIGITAL, MIXED SIGNAL AND RF PRODUCTS

The company provides turnkey solutions and support services, package design and test solutions for digital, mixed signal and RF products. The manufacturing services include wafer test, wafer bumping, wafer probing, flip chip and final tests.

Unisem offers a wide range of copper lead frame packaging products having various pin counts. Our range of products includes Small Outline Integrated Circuit (SOIC) - 150ml and 300ml, Plastic Dual In Line Package (PDIP) 300ml, 400ml and 600ml, Plastic Leaded Chip Carrier (PLCC) 28, 32, 48, 52 and 68 leads.

• Quarter Small Outline Package (QSOP) 150ml
• Quarter Very Small Outline Package (QVSOP) 150 ml
• Shrink Small Outline Package (SSOP) 209ml and 300ml.
• Small Outline Transistor (SOT) 23 and SOT223
• Thin Small Outline Transistor (TSOT) 5, 6 leads
• Mini Outline Package (MSOP) 8, 10 leads, EP leads and COL leads
• Thin Shrink Small Outline Package (TSSOP) 4.4mm and TSSOP 6.1mm
• Single Carrier (SC) 70 3, 4, 5, 6
• Transistor Outline (TO) 220 and TO 263
• SLP Quad Flat No Lead (QFN) 1.6mm x 1.2mm to 10 mm x 10mm
• MICRO-X package
• Low Profile Ball Grid Array (LBGA) up to 40mm x 40mm
• Low Profile Fine Pitch Ball Grid Array (LFBGA) up to 40mm x 40mm
• Thin Fine Pitch Ball Grid Array (TFBGA) up to 40mm x 40mm
• Very Thin Fine Pitch Ball Grid Array (VFBGA) up to 40mm x 40mm
• Land Grid Array (LGA) up to 40mm x 40mm
• Thick Quad Flat Pack (QFP) 2.2mm / 2.7mm / 3.4mm
• Thick Low Profile Quad Flat Pack (LQFP) 1.4mm and 1.0mm, and Thick Thin Quad Flat Pack (TQFP)

The copper lead frame packaging products are made of RoHS compliant material sets. These new "green" material sets are verified and tested as per MIL-SPEC-883 and JEDEC standards.

TESTING CAPABILITY

The company has 60,000ft² of testing floor equipped with 115V and 230V power supply systems, RF screen rooms and compressed air supply systems. Unisem is equipped with a large installed base of test systems that include Teradyne Catalyst-RF, Intefra-Flex, J750 and Credence ASL3000-RF and ASL1000 for linear testing, logical testing, RF testing, and handling services.

WAFER BUMPING, MULTICHIP MODULES AND SYSTEM IN PACKAGE TECHNOLOGY

Based on successful APS technology, Unisem’s joint venture company, UAT offers wafer bumping and wafer probing services that include gold, copper pillar and solder bumping technologies.

We also offer advanced packaging options that include multi-die and passive components, in leadframe or laminate based packages.

QUALITY SYSTEMS AND CUSTOMER SATISFACTION

Unisem is focused on quality, technology and customer satisfaction. Quality is assured throughout the manufacturing process by means of statistical quality control and monitoring procedures. All our manufacturing sites are accredited with QS9000 quality standards and ISO 14001 environmental standards.

ABOUT UNISEM

Unisem was incorporated in 1989 and commenced operations in 1992 as an independent IC packaging and test house. Since its creation, Unisem has invested approximately 1.2 billion Malaysian Ringgits in land, buildings, plant and machinery in its main production facilities in Ipoh, Malaysia. The factories have a total area of approximately 570,000ft² and stand on a 15 acre site.