Unisem

Unisem is equipped with state-of-the-art test systems that include Teradune Catalyst-RF, Intefra-Flex, J750 and Credence ASL3000-RF and ASL1000.

Unisem - Package Design, Bump Fab, Wafer Probing, Wafer Grinding, Design for Test, Assembly, Final Test, Packaging and Testing of IC's, Tape and Reel

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