Unisem Group is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. Unisem offers an integrated suite of packaging and test services - such as wafer bumping, wafer probing and wafer grinding - a wide range of lead frame and substrate IC packaging, and high-end RF and mix-signal test services.
Our turn-key services include design, assembly, test, failure analysis, and electrical and thermal characterisation. With approximately 10,000 employees worldwide, Unisem has factory locations in Malaysia, Wales, China, Indonesia and the US. The company headquarters are located in Kuala Lumpur, Malaysia.
Full turn-key solutions for wafer level CSP
Unisem assembles a broad range of standard and custom lead frame, leadless and array packages with pin counts ranging from 3 to 700+.
We offer full turn-key solutions for wafer level CSP from wafer bumping, packaging, test (probing) and full wafer map integration to handle die sizes from 0.5mm2 - 7mm2 in both our Ipoh and Chengdu factories.
Unisem builds custom MEM's packaging for a number of applications that require unique cavity environments, including solutions for pressure sensors and microphones. Much of our MEM's package development takes place in our development facility in Wales and is then transferred to our high-volume factories in Asia.
Packaging test services
In addition to package assembly services, Unisem provides a full range of packaging test services. Capabilities include analog, digital and mixed signal testing, with over 100 test systems.
To further reduce our customer's time-to-market, Unisem also offers the following post-test services: lead scan, lead conditioning, tape and reel, vacuum packing, burn-in, dry-bake, final pack / stock and drop shipping.
Unisem offers wafer bumping services through our wafer bumping fab laboratory in Ipoh (UAT) and our factory in Chengdu, China. Located at the same location as our assembly and test factories, customers receive seamless integration of a wide variety of services under one roof covering wafer bumping, wafer backgrinding, wafer probe, dicing, final test and flip-chip assembly.
Our two wafer bumping fabs offer gold bumps, copper pillar bumps and solder bumps (through ball drop, plating and solder paste printing). Additionally, they provide repassivation and bond pad redistribution services.