Carl Zeiss SMT - Mask Qualification and Repair, Failure Analysis and Nano Imprint Photography Tools

Carl Zeiss SMT AG and its divisions serve the worldwide semiconductor and nano-technology industry with a broad variety of technologies and solutions. Products range from leading edge subsystems and components for lithography production tools (e.g. illumination and projection lithography optics, optics for Excimer lasers) to process control tools for wafer and mask inspection and failure analysis, based on innovative optical and e-beam technology.

A further core competence comprises e-beam based products and solutions for advanced device development, failure analysis and process control.

AIMS™ MASK EVALUATION TECHNOLOGY FOR RETICLE QUALIFICATION AND PROCESS DEVELOPMENT

The unique AIMS™ mask evaluation technology optically emulates and analyses the printability of mask patterns or defects by selecting stepper equivalent conditions concerning wavelength, numerical aperture, sigma and reduction factor. Carl Zeiss AIMS™ is the rapid evaluation method without requiring wafer prints. High repeatability of measurement results is achieved for reticle qualification and process development with AIMS™ systems.

MERIT™ MG E-BEAM BASED MASK REPAIR TOOL

The new MeRiT™ MG repair tool, which has been jointly developed with Nawotec, is the first e-beam mask repair production tool available for 193nm masks. The MeRiT™ MG multi node tool (90/65nm) is capable of repairing both in etching and in deposition mode without any negative effects on the quartz substrate. MeRiT™ is the mask repair tool developed to enable future steps on the roadmap.

The Nano Technology Systems Division of Carl Zeiss SMT develops, manufactures and delivers high performance scanning and transmission electron microscopes, focussed ion beam systems, customized e-beam based system and nano imprint lithography systems for end-users and OEM markets. The range of high end products for the semiconductor market includes the following.

GEMINI HIGH RESOLUTION FIELD EMISSION SEMs (SCANNING ELECTRON MICROSCOPY)

For device development and failure analysis, GEMINI delivers the ultimate required imaging quality over the complete voltage range. The unique boosted column technology delivers superb imaging quality down to 100V, analytical capabilities, high contrast in-column detection of topographic and compositional signals, all in one tool.

CROSSBEAM® FIB (FOCUSED ION BEAM) TOOLS FOR 3D WAFER ANALYSIS

The CrossBeam® tools enable precise and fast cross-sectioning and TEM preparation on any pre-selected position on wafers. Utilizing the unique GEMINI field emission column, the CrossBeam® is unrivalled at ultra high resolution at low kV, life imaging during FIB operation and examination of magnetic materials (R/W heads, MRAM and FeRAM).

LIBRA® ENERGY FILTERED TEMs (TRANSMISSION ELECTRON MICROSCOPY)

LIBRA® TEMs are designed for atomic scale visualisation and analysis of critical structures, interfaces, films and barriers, processors and devices. The unique in-column omega energy filter, together with the WinTEM™ user interface, enables high quality imaging and analysis with genuine ease-of-use operation.

IMPRIO™ NANO IMPRINT LITHOGRAPHY SYSTEMS

Molecular Imprint Inc.'s IMPRIO™ nano imprint lithography systems are based on the patented S-FIL imprint process. The S-FIL™ flash imprint technology is a simple step-and-repeat, room temperature, low-pressure, nano-imprint process for structures down to 20 nanometer. The process is cost-effective and the perfect solution for 3D, micron and sub 50nm patterning for research and small volume manufacturing. Carl Zeiss SMT is the exclusive distributor of MII's products for Europe.