SEZ Group - Pioneer and Leading Provider of Single-Wafer Wet Processing Solutions

The SEZ Group is the leading provider of single-wafer, wet-processing solutions for the global semiconductor industry. With an installed base of more than 1,100 spin-processing tools, SEZ's systems span across today's leading IC manufacturers.

The company's product portfolio includes flexible, best-of-breed, low Cost-of-Ownership (CoO), single-wafer platforms for Back-End-Of-Line (BEOL) – and now Front-End-Of-Line (FEOL) – cleaning, etching and stripping applications, leveraging a variety of chemistries that allow customers to operate in zero-particle environments at 45nm and below.

SINGLE-WAFER PROCESSING SOLUTIONS

SEZ's "Right Technology, Right Time" philosophy is a key factor in the success of the Da Vinci™ series for BEOL polymer cleaning and BS / bevel cleaning, which has received several industry accolades

The Da Vinci's introduction revolutionised the cleaning industry, both by providing a single-wafer wet technology platform precisely when the industry hit critical limits with batch cleaning solutions, and by igniting and fuelling the BEOL conversion to single wafer.

Leveraging its expertise in BEOL single-wafer wet clean processes and utilising the same collaborative approach with key industry players and consortia as with the Da Vinci series, SEZ is well-equipped to address FEOL wet processing challenges with the Esanti single-wafer processing platform.

ESANTI™ SINGLE-WAFER PROCESSING PLATFORM

The latest solution in SEZ's single-wafer portfolio, the Esanti single-wafer processing platform was developed with future roadmap requirements in mind, and is a flexible, multi-chamber, single-wafer wet processing platform that is intended to address FEOL cleans at 45nm nodes and below.

Incorporating proven capabilities previously integrated into the Da Vinci series, the Esanti single-wafer processing platform also includes new capabilities (such as a double-sided process for FEOL cleans; an all-wet [non-plasma] resist strip; non-damage particle removal; and drying without watermarks or pattern collapse), that enhance defect removal and surface drying to effectively address a wide range of FEOL high-volume manufacturing applications.

These new capabilities improve single-wafer throughput – placing it on par with wet-bench approach throughputs – as well as effectively reducing defects caused by watermarks, etc. on the wafer surface, ultimately improving device performance and yield. Moreover, these capabilities, coupled with the Esanti's ability to recirculate chemistry and low consumption, provide the potential to deliver significant CoO improvements.

THE SEZ GROUP

The SEZ Group maintains operations in the Asia-Pacific region (Taiwan, South Korea, China and Singapore), Europe, Japan and North America. SEZ Holding AG is traded on the SWX Swiss Exchange under the symbol SEZN.