STS - Plasma Etch and Deposition Equipment

Surface Technology Systems plc (STS) designs and manufactures a range of plasma etch and deposition equipment used in the production of semiconductor related devices, within MEMS, optoelectronics, compound semiconductors and packaging applications.

STS has strong presence in each of its served markets and distributes its machines worldwide through an experienced sales and service operation consisting of direct sales, distributors and agents. The Group currently markets in over 30 countries and has an installed base of approximately 800 machines with customers.

PLATFORM OPTIONS

STS offers all its process technologies on a choice of three platforms designed to enable easy upgrade and transition from R&D to full-scale production:

• MultiplexPro - single chamber, manual loadlock with carousel option for up to four wafers, for R&D or small wafer volume applications
• MACSPro - MultiplexPro Atmospheric Cassette System, which is an upgrade to the MultiplexPro, allowing up two cassettes (50 wafers) to be processed automatically using robotic transfer. Suitable for increasing throughput from R&D to pilot production.
• ASPECTPro - cluster system which can configured with up to four process chambers and two vacuum cassette loadlocks, with fully automatic robotic wafer handling, suitable for full-scale production applications.

DEEP SILICON ETCH

STS is a market leader in deep silicon etching for MEMS with its Advanced Silicon Etch (ASE®) process, which offers etch rates up to 20µm/min, and for optoelectronic applications can produced smooth etched surfaces with Ra<20nm. Originating from the 'Bosch' DRIE process, STS' ASE® process offers additional patent-protected enhancements for Silicon on Insulator (SOI) processing, and 'parameter ramping' for optimized profile control of high aspect ratio features.

DEEP DIELECTRIC ETCH

STS Advanced Oxide Etch (AOE™) offers precision etching of doped and undoped optical waveguide cores, resist transfer processing for fabrication of microlenses and deep etching of MEMS for microfluidic or biomedical applications. Using the AOE™ system, the need for mechanical cleaning of the process chamber is reduced by a factor of 10 when compared to conventional ICP or RIE systems.

COMPOUND SEMICONDUCTOR ETCH

STS offers Inductively Coupled Plasma (ICP) or Reactive Ion Etching (RIE) for processing a wide range of compound semiconductor materials based on InP, GaAs, and GaN. These are used in applications such as via etching and fabrication of VSCELs, LASERs, LEDs, MMICs, and HBTs.

PLASMA ENHANCED CHEMICAL VAPOUR DEPOSITION

More than 200 STS PECVD systems are installed worldwide, used to deposit a wide range of inorganic and organic, doped and undoped films. STS' PECVD system offers deposition of high quality films at low temperature and pressure, with high RI and thickness uniformities. STS can offer both silane and TEOS-based processes, and an optional liquid delivery system for up to five low vapour pressure pre-cursors for applications such as Erbium doping.

OTHER PROCESSES

STS has formed a number of agreements with other key equipment manufacturers to offer their customers a wider range of processes which includes:

• Plasma-less, isotropic chemical vapour etch processes
• XeF2, silicon etching (XACTIX, Inc)
• HF for SiO2 etching (Primaxx, Inc)
• Laser micromachining (Exitech Ltd)