<p>High utilisation has returned to the semiconductor manufacturing industry, and with it, all the challenges associated with achieving the most output at lowest cost. Tool-based approaches focus on solutions that improve tool unit output (wafers/day) through excursion control, process control (Cpk), and throughput enhancements. Fab-wide approaches focus on using automation to improve throughput and optimise cycle time. In this article, we survey both approaches, and offer our insight into future trends.</p> <p>Please download this free white paper for more information</p>

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