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Performance Gains through Automation

18 April 2011 by Applied Materials

High utilisation has returned to the semiconductor manufacturing industry, and with it, all the challenges associated with achieving the most output at lowest cost. Tool-based approaches focus on solutions that improve tool unit output (wafers/day) through excursion control, process control (Cpk), and throughput enhancements. Fab-wide approaches focus on using automation to improve throughput and optimise cycle time. In this article, we survey both approaches, and offer our insight into future trends.

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