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Etch Chamber Matching using Applied E3

18 April 2011 by Applied Materials

Chamber matching is one of the most critical challenges in nanometer-scale processing. As device geometries shrink, processes become increasingly sensitive to small differences in chamber performance. The essence of the chamber matching challenge is in finding and controlling these small sources of variability that can impact on-wafer results. The payoff is higher device yield and improved tool availability.

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  • Etch Chamber Matching using Applied E3