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Assembly and Packaging White Papers

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Latest White Papers

See-Through Sillicon Inspection Application Studies Based on Tradtional Silicon Imager With semiconductor development processes hitting harder and harder on Moore's law to continuously scale down, high-density advanced packaging technologies become a promising alternate route...

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Optimisation Solvers in Run-to-Run Control Semiconductor manufacturing processes with multiple settings or multiple targets, such as furnace applications or processes controlling uniformity, may not have a single algebraic solution,...

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Sensitivity and Performance Estimates for the Multiple Wavelength, Multiple Incidence Angle Ellipsometry for OCD Applications New complex transistors architectures expand application space of the scatterometry beyond measurements of the simple photoresist and a-Si gratings towards characterisation of more...

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GST Cell Array Characterisation Using Picosecond Ultrasonics Phase change random access memory alloys (PRAM or PCM) are a class of non-volatile memory that is thought as viable alternatives to flash memory technologies depending on the end applications...