As we mentioned in our previous newsletter, a new edition of the ANSI/ESD S20.20 was published in February. A paper outlining the most important changes can be found here. The IEC 61340-5-1 and 61340-5-2 standards are also due to be reviewed, with the members of the IEC/TC 101 convening in Japan this June to discuss these changes. Most notably, the IEC 61340-4-2 standard will be completely amended, setting unprecedented standards in ESD procedure. Further information can be found in our next newsletter. A warning to ElectroStat customers: We found out that several certification and inspection bureaus claim to approve materials in compliance with the IEC 61340-5-1 standard, stating that they are using the IEC 61340-4-1 procedure, when, in fact, they are using different standards, measuring methods, measuring times, electrodes and weights.

In February 2007, a new version of the ANSI/ESD S20.20 was published, while the new IEC 61340-5-1 and IEC 61340-5-2 are being printed at the moment. The IEC 61340-5-3 is proposed to be sent to the members of the IEC / TC 101, who will have until the end of March to give their remarks. The final vote is expected to be in June 2007 during the IEC / TC 101 meeting in Japan. ElectroStat's Vincent Neel is an IPC certified ESD-instructor, and a member of the ESD Association. A lot of new or revised papers and presentations can be found at www.es-electrostat.com/downloads.htm. ELECTROSTAT MEETS ISO / IEC 17021 and ISO 19011 REQUIREMENTS At the beginning of the year ElectroStat started a new service, which can be seen at www.

Equipment Acquisition Resources would like to invite you to visit us at this year's SEMICON WEST 2006 (July 12-14) at the Moscone Center, San Francisco, CA (South Hall Booth 2971). Now in our third year of exhibiting at the show, we had so much success that there was no hesitation in our return. Since last year's participation, we have expanded our already successful process engineering program to include manufacturing capabilities for dicing saws and slicing saws - further enhancing our technology base. We specialize in offering R&D process development work to our customers, which includes complete development, application testing and production facilities for all crystalline electronic materials.

Surface Technology Systems plc (STS) (LSE: SRTS), a leader in plasma processing technologies used in the manufacturing and packaging of advanced electronic devices, today announced that it has received an order worth over £2 million from a major manufacturer for Micro-Electro-Mechanical Systems (MEMS) production equipment. The order includes multiple Pegasus processing chambers for deep silicon micromachining of MEMS for use in consumer end-products. The Pegasus source offers significantly higher silicon etch rates than other deep reactive ion etch (DRIE) tools currently on the market. STS offers a choice of two cluster platforms for multiple chamber operation; the VPX, which is supplied with one vacuum cassette and up to three process chambers, and the CPX which has two vacuum cassettes and up to four process chambers.

Equipment Acquisition Resources, Inc. of Chicago, Illinois, USA, is proud to annouce that we are official dealers for P.R. Hoffman of Carlisle, Pennsylvania, for double-sided lappers and polishers throughout the United States and Europe.

With a strong emphasis on helping customers worldwide with their specific crystalline applications, we offer the finest technology available in double-sided polishing, lapping, and fine grinding of all electronic and semiconductor related materials.

Through our process development center, we also provide extensive process development services for customer applications to ensure that as our customer you will be as successful as possible for your products.

We will be introducing some new and very exciting innovations through press releases over the next several months which will afford our customers increasing benefits for using our systems, machines, and technologies.

We look forward to serving all of you, and please call us with your
applications and specific needs.

Thank you,

Sheldon Player, President

Newport, Wales, United Kingdom - 18 August 2005 - Surface Technology Systems plc (STS) (LSE: SRTS), a leader in plasma process technologies for the growing MEMS and related markets, today announced that it has received an order for its new Pegasus Deep Reactive Ion Etch system from leading automotive MEMS device manufacturer, Robert Bosch GmbH. The order from Bosch strengthens STS' long-standing relationship with the German company, and is the fifth such order since Pegasus was launched on June 28 2005. The Pegasus system will be installed at Bosch's MEMS wafer fab in Reutlingen, Germany. It will be utilised in a number of research and development projects to develop new MEMS devices.

IPEC 472 Equipped with ViPRR™ Carrier Technology Delivers Leading Edge Process Capability Axus Technology announced the recent delivery of an IPEC 472 CMP tool equipped with the Strasbaugh ViPRR™ carrier upgrade to Micrel in San Jose, California. The ViPRR carrier upgrade provides IPEC tool users with leading-edge carrier technology for use on their proven IPEC production tools. After having installed more than four hundred ViPRR carriers on Strasbaugh CMP tools, Strasbaugh selected Axus Technology to design the ViPRR carrier upgrade kit for installation on IPEC CMP tools. The resulting ViPRR carrier upgrade significantly extends the useful life of users' CMP equipment.

Carl Zeiss SMT Sets New Record Milestone in Sub-Angstrom E-beam Imaging Carl Zeiss SMT announces a major break-through by achieving a record image resolution of 0.8 Angstrom (0.08 nanometer) during qualification of its latest generation ultra-high-resolution transmission electron microscope (UHRTEM). The milestone was achieved using a newly developed 200kV field-emission UHRTEM equipped with electron optical components for aberration correction, electron beam monochromatization and energy filtered imaging, partly co-developed with CEOS GmbH, Heidelberg. By unique and proprietary integration of these advanced components into a revolutionary new UHRTEM platform, image resolution of even down to 0.

Carl Zeiss SMT will be exhibiting at the major European semiconductor trade show Semicon Europa, 12 to 14 April 2005 in Munich, Germany. The Semiconductor Metrology Systems Division will present two product lines: AIMS mask qualification tools and MeRiT advanced mask repair tools. The unique AIMS™ family of Mask qualification tools which are used in mask shops around the globe. AIMS™ mask qualification is extremely time effective, no printing needed, and contributes significantly to yield enhancement. With new tools AIMS is now available for mask qualification directly in the fab to qualify the masks before defects causes substantial damages to production.

Axus Technology and Richmond, California-based Berkeley Process Control, Inc. have announced the appointment of Axus Technology as a value added reseller for Berkeley products. Axus Technology, a global provider of equipment, parts and engineering services for chemical mechanical planarization (CMP), wafer cleaning and wafer-thinning equipment users, will offer Berkeley control systems and components used on existing equipment throughout Asia and North America. “Axus Technology's expertise in CMP process and Berkeley control products, combined with their relationships with semiconductor equipment end users, make an excellent fit in terms of providing world-class service to system users,” said Lenson Wong, director of marketing at Berkeley.

CHANDLER, Ariz., July 9, 2004 - A strategic partnership between Axus Technology, a global provider of semiconductor manufacturing equipment, parts, and engineering services for chemical mechanical planarization (CMP), wafer cleaning and wafer-thinning equipment users, and Strasbaugh has led to the release of Strasbaugh's established ViPPR™ carrier technology for retrofit on IPEC 472 &372M chemical mechanical planarization (CMP) tools. The ViPPR carrier provides for immediate improvements in process and yield performance. Key performance advantages include improving the edge exclusion to 3 mm, providing multi-zone back pressure, and optimal center-to-edge uniformity.

Q-Star Test is the world-leading provider of advanced IDD-based test and measurement solutions, is a provider of Test and Design For Test (DFT) consulting and training services and also offers engineering services for the development of customized solutions. We offer standard and customized products and services that support a total-solution test strategy, consisting of measurement equipment, consulting services and training courses. Q-Star Test serves its customers with Test and DFT solutions, helping them to reduce test efforts and test costs whilst improving testability and product quality.

Cosense, Inc. is a highly innovative company using ultrasonic technology in the pharmaceutical, biomedical and semiconductor industries. Cosense has been the front runner for special level-problem solving, in semiconductor fluid-handling, wafer counting, wafer profiling, wafer alignment, wafer flatness, buckling, and gripping. Fluid handling level sensors are designed to monitor liquid level in chemical delivery systems, acid and solvent tanks, wafer preparation and etching equipment, gas scrubbers, and monitoring of high purity chemicals in a stainless steel canister. Cosense Sonic Eye™ series non-invasive level sensors detect fluid level as a high / low alarm in metal, glass and plastic containers with a disposable or reusable sensor, which eliminates the problem of fluid contamination.

Tec-Sem, founded in 1981, is one of the pioneers in cleanroom automation. The company was strongly involved during the conversion from 6in to 8in wafer processing in 1986 and also in the introduction of 300mm automation equipment in 1996. In 1994, Tec-Sem introduced the first bare reticle storage systems to the market which today are industry standard. Tec-Sem offers a wide range of automation systems for cleanroom applications such as single wafer management systems, fab automation and logistic systems as well as wafer loading systems for batch process equipment. Thanks to the more than 20 years' experience in developing wafer handling systems, Tec-Sem is a well-trusted partner in the semiconductor industry.

Samsung Electronics is constructing a 300mm wafer fab in Austin, Texas. This, the first 300mm fab in central Texas, will produce DRAMs and other devices. The fab will cost around $3.5bn, with Texas having offered Samsung over $230m in tax abatements and other incentives. This was however apparently less than half the amount offered by New York, which was also interested in hosting the new plant. Production should begin by late 2007 or early 2008, although it will take several years to completely outfit the factory. The plant adds to Samsung's existing 200mm DRAM fab at Austin, opened in 1998.

Nokia has chosen Chennai in the state of Tamil Nadu, Southern India, for its tenth mobile phone factory. The facility will cost up to $150m over three years, and will make entry-level, mid-level, and top-end GSM (Global System Mobile) and CDMA (Code division multiple access) handsets for the Indian market. The plant is located at Sriperumbudur, about 50km west of Chennai, on an 85ha (210ac) plot. Construction began in April 2005, and production in March 2006. Nokia is building up the factory gradually, with small quantities of a basic entry-level handset ironing out any initial production glitches.

Toshiba Corp. and SanDisk are building a new 300mm wafer fabrication facility at Toshiba's Yokkaichi operations in Japan. The companies plan to start construction of the new facility, called Fab-4, in August 2006. Initial production operations are scheduled to begin in Q4 2007. Toshiba will fund construction of the building, while both Toshiba and SanDisk will provide funds for the manufacturing equipment. Fab-4 will be similar in size to the companies' Fab-3 300mm plant currently also operating at Yokkaichi. Toshiba has increased its capital-spending budget several times over the last year, partly to fund expansion at Fab-3 and partly to fund Fab-4.