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http://www.semiconductor-technology.com/contractors/cleanroom/electrostat/press2.html Wed, 20 Jun 2007 12:31:30 GMT http://www.semiconductor-technology.com/contractors/cleanroom/electrostat/press2.html ESD (Electrostatic Discharge) As we mentioned in our previous newsletter, a new edition of the ANSI/ESD S20.20 was published in February. A paper outlining the most important changes can be found here. The IEC 61340-5-1 and 61340-5-2 standards are also due to be reviewed, with the members of the IEC/TC 101 convening in Japan this June to discuss these changes. Most notably, the IEC 61340-4-2 standard will be completely amended, setting unprecedented standards in ESD procedure. Further information can be found in our next newsletter. A warning to ElectroStat customers: We found out that several certification and inspection bureaus claim to approve materials in compliance with the IEC 61340-5-1 standard, stating that they are using the IEC 61340-4-1 procedure, when, in fact, they are using different standards, measuring methods, measuring times, electrodes and weights. We are working on a paper outlining these issues, but in the meantime, you can e-mail us with any questions you have regarding ESD procedures. Dutch speaking customers can also request a copy of our presentation regarding ESD flooring. Quality: Last month, General Motors published their new customer-specific requirements to be used in conjunction with ISO/TS 16949. This document can be downloaded here. In May, ElectroStat joined forces with consultancy company Comatech to provide training regarding internal communication procedures. Feedback from the participants proved so positive that we are due to repeat this training in February 2008. http://www.semiconductor-technology.com/contractors/cleanroom/electrostat/press1.html Thu, 05 Apr 2007 10:29:36 GMT http://www.semiconductor-technology.com/contractors/cleanroom/electrostat/press1.html ElectroStat: an ISO / IEC 17021, ISO 19011 and IATF-Approved Company In February 2007, a new version of the ANSI/ESD S20.20 was published, while the new IEC 61340-5-1 and IEC 61340-5-2 are being printed at the moment. The IEC 61340-5-3 is proposed to be sent to the members of the IEC / TC 101, who will have until the end of March to give their remarks. The final vote is expected to be in June 2007 during the IEC / TC 101 meeting in Japan. ElectroStat's Vincent Neel is an IPC certified ESD-instructor, and a member of the ESD Association. A lot of new or revised papers and presentations can be found at www.es-electrostat.com/downloads.htm. ELECTROSTAT MEETS ISO / IEC 17021 and ISO 19011 REQUIREMENTS At the beginning of the year ElectroStat started a new service, which can be seen at www.es-electrostat.com/quality_management.htm. Until now, one of the biggest problems organisations had with the implementation of the ISO/TS 16949:2002 was the requirement that all suppliers had to be certified to ISO 9001:2000 by an accredited third party certification body (§7.4.1.2). This caused a difficulty, as a lot of organisations co-operate with little pop and mom shops. Only suppliers to Ford had the possibility to approve suppliers without this certification, as long as the STA agreed with the audit and the auditor. In December the IAOB published a new sanctioned interpretation (viewable at www.iaob.org/showPage.php?title=ISO/TS 16949:2002 7.4.1.2 Supplier quality management system development), which allows organisations to release suppliers without an ISO 9001 certificate if the organisation performs second party audits and the applicable standards (ISO / IEC 17021 and ISO 19011), are met. ElectroStat fulfils all these requirements, and can therefore approve your suppliers without an ISO 9001 certificate. AN IATF-APPROVED COMPANY A second problem that organisations have is the qualification of the internal auditors. Although there are no formal rules about this, a lot of external auditors have their own opinion and write deviations if the internal auditors are not qualified by one of the IATF bodies. ElectroStat, by contrast, has the written approval of an IATF body to provide such training and to write certifications. The beginning of the year is a time when a lot of organisations audit their archives and review their procedure about record retention. We want to inform our customers that some OEMs are planning to switch the retention time of documents regarding product integrity from 15 to 20 years. We also want to inform our Belgian customers that the legal retention time for financial data has decreased from ten to seven years. http://www.semiconductor-technology.com/contractors/wafer/equipment/press2.html Fri, 07 Apr 2006 14:12:02 GMT http://www.semiconductor-technology.com/contractors/wafer/equipment/press2.html Equipment Acquisition Resources to Exhibit at SEMICON WEST 2006 Equipment Acquisition Resources would like to invite you to visit us at this year's SEMICON WEST 2006 (July 12-14) at the Moscone Center, San Francisco, CA (South Hall Booth 2971). Now in our third year of exhibiting at the show, we had so much success that there was no hesitation in our return. Since last year's participation, we have expanded our already successful process engineering program to include manufacturing capabilities for dicing saws and slicing saws - further enhancing our technology base. We specialize in offering R&D process development work to our customers, which includes complete development, application testing and production facilities for all crystalline electronic materials. This sector is quickly becoming the core of our business and we offer extended work in this area for the continuing success of our customers. If precision is vital and material saving is critical, we are a cut above the rest and will prove it to you by seeing your project through from start to finish. We understand the importance of accuracy and currently have some of the best equipment on the market today for processing your materials and substrates. Let Equipment Acquisition Resources, Inc. create an application process to slice or dice your substrates, show you our proven results and then continue to process your substrates with our extended manufacturing contracts. Visit us today online and let us help you to create an application process to dice or slice your substrates, show you our proven results and then continue to process your substrates with our extended manufacturing contracts. http://www.semiconductor-technology.com/contractors/wafer/sts/press2.html Tue, 28 Mar 2006 10:27:41 GMT http://www.semiconductor-technology.com/contractors/wafer/sts/press2.html STS Wins £2million Order for MEMS Production Equipment Surface Technology Systems plc (STS) (LSE: SRTS), a leader in plasma processing technologies used in the manufacturing and packaging of advanced electronic devices, today announced that it has received an order worth over £2 million from a major manufacturer for Micro-Electro-Mechanical Systems (MEMS) production equipment. The order includes multiple Pegasus processing chambers for deep silicon micromachining of MEMS for use in consumer end-products. The Pegasus source offers significantly higher silicon etch rates than other deep reactive ion etch (DRIE) tools currently on the market. STS offers a choice of two cluster platforms for multiple chamber operation; the VPX, which is supplied with one vacuum cassette and up to three process chambers, and the CPX which has two vacuum cassettes and up to four process chambers. John Saunders, CEO of STS said, "We are very excited by this order, as not only is it one of the largest orders STS has won recently, but it underlines the success of this relatively new product which was launched eight months ago. We feel it also verifies the capability of our new cluster systems to satisfy the requirements of production customers." David Haynes, STS' Sales & Marketing Director added, "We see this order as further proof that the major MEMS manufacturers are successfully using or selling their devices for high volume applications such as automotive or consumer products." This new order increases STS's current order book to over £12.1 million, all of it for delivery in 2006 and much of it in the first half. This is the highest level of order book STS has had since 2001. http://www.semiconductor-technology.com/contractors/wafer/equipment/press1.html Fri, 24 Mar 2006 17:17:50 GMT http://www.semiconductor-technology.com/contractors/wafer/equipment/press1.html EAR, Inc; an Official Dealer for P.R. Hoffman Equipment Acquisition Resources, Inc. of Chicago, Illinois, USA, is proud to annouce that we are official dealers for P.R. Hoffman of Carlisle, Pennsylvania, for double-sided lappers and polishers throughout the United States and Europe. With a strong emphasis on helping customers worldwide with their specific crystalline applications, we offer the finest technology available in double-sided polishing, lapping, and fine grinding of all electronic and semiconductor related materials. Through our process development center, we also provide extensive process development services for customer applications to ensure that as our customer you will be as successful as possible for your products. We will be introducing some new and very exciting innovations through press releases over the next several months which will afford our customers increasing benefits for using our systems, machines, and technologies. We look forward to serving all of you, and please call us with your applications and specific needs. Thank you, Sheldon Player, President http://www.semiconductor-technology.com/contractors/wafer/sts/press1.html Thu, 18 Aug 2005 15:38:20 GMT http://www.semiconductor-technology.com/contractors/wafer/sts/press1.html STS Wins Order from Bosch for New Pegasus Deep Reactive Ion Etch (DRIE) System Newport, Wales, United Kingdom - 18 August 2005 - Surface Technology Systems plc (STS) (LSE: SRTS), a leader in plasma process technologies for the growing MEMS and related markets, today announced that it has received an order for its new Pegasus Deep Reactive Ion Etch system from leading automotive MEMS device manufacturer, Robert Bosch GmbH. The order from Bosch strengthens STS' long-standing relationship with the German company, and is the fifth such order since Pegasus was launched on June 28 2005. The Pegasus system will be installed at Bosch's MEMS wafer fab in Reutlingen, Germany. It will be utilised in a number of research and development projects to develop new MEMS devices. The flexibility of the STS software with direct manual control of the system enables manufacturers such as Bosch to fully optimize their individual processes, ensuring product quality and high yield. In the MEMS market, where device designs often differ significantly from one manufacturer to another, STS believes its equipment has the capability to meet the demands of a wide range of customers - from 'blue-sky' researchers to high volume manufacturers such as Bosch. In addition to the process advantages offered by the Pegasus technology, a key factor in gaining this latest order from Bosch was STS' commitment to providing outstanding customer support and service within the German territory. Earlier this year STS strengthened its team at the German Sales Office in Ulm with the recent appointment of a Regional Customer Support Manager, who will work closely with customers in the region. "The order from Bosch for the Pegasus system is significant news for STS," said Mutsuo Mukuda, Vice Chairman of STS. "Not only have we placed Pegasus with one of our largest and most prestigious European clients, but the sale also reinforces the belief that we have in Pegasus. The range of enhancements and developments that Pegasus brings to the MEMS market, such as the high uniformity plasma source, result in higher etch rates and improved etch uniformity, leading to higher throughput and device yield. We fully expect Pegasus to gain further traction in the MEMS market." http://www.semiconductor-technology.com/contractors/wafer/axus/press3.html Tue, 12 Jul 2005 12:12:16 GMT http://www.semiconductor-technology.com/contractors/wafer/axus/press3.html Axus Technology Delivers Multi-Zone Process Control on Micrel CMP Tool IPEC 472 Equipped with ViPRR™ Carrier Technology Delivers Leading Edge Process Capability Axus Technology announced the recent delivery of an IPEC 472 CMP tool equipped with the Strasbaugh ViPRR™ carrier upgrade to Micrel in San Jose, California. The ViPRR carrier upgrade provides IPEC tool users with leading-edge carrier technology for use on their proven IPEC production tools. After having installed more than four hundred ViPRR carriers on Strasbaugh CMP tools, Strasbaugh selected Axus Technology to design the ViPRR carrier upgrade kit for installation on IPEC CMP tools. The resulting ViPRR carrier upgrade significantly extends the useful life of users' CMP equipment. "The IPEC 472 together with the ViPRR carrier upgrade, will enable Micrel to enhance its multi-zone CMP process control technology," stated Guy Gandenberger, Vice President of Wafer Fab & Foundry Operations for Micrel. "The solution promises to be a cost-effective strategy for upgrading our legacy CMP tools without the significant expense of additional capital equipment." The Strasbaugh ViPRR upgrade kit was introduced several months ago and has now been installed in multiple production facilities. Mike Kirkpatrick, vice president of sales at Strasbaugh noted, "The IPEC ViPRR upgrade is being evaluated by several users and was recently selected by one user for installation on more than a dozen IPEC 472 tools. The outstanding process results seen in fabs and in our product demonstrations have led to increasing interest by IPEC tool owners." The ViPRR upgrade kit was designed to be installed without making any structural or software changes to the IPEC tools. "We focused on creating an upgrade that met all of the mechanical interface requirements for metrology and wafer handling, without making any changes to the tool software." said Dan Trojan, vice president of engineering at Axus. "The ViPRR upgrade improves performance without changing the tool operation." The ViPRR upgrade kit is available on tools provided by Axus Technology or as a field retrofit provided by Strasbaugh. http://www.semiconductor-technology.com/contractors/metrology/carl_zeiss/press1.html Thu, 17 Mar 2005 16:38:46 GMT http://www.semiconductor-technology.com/contractors/metrology/carl_zeiss/press1.html New Record in TEM Resolution Carl Zeiss SMT Sets New Record Milestone in Sub-Angstrom E-beam Imaging Carl Zeiss SMT announces a major break-through by achieving a record image resolution of 0.8 Angstrom (0.08 nanometer) during qualification of its latest generation ultra-high-resolution transmission electron microscope (UHRTEM). The milestone was achieved using a newly developed 200kV field-emission UHRTEM equipped with electron optical components for aberration correction, electron beam monochromatization and energy filtered imaging, partly co-developed with CEOS GmbH, Heidelberg. By unique and proprietary integration of these advanced components into a revolutionary new UHRTEM platform, image resolution of even down to 0.7 Angstrom was demonstrated for certain image directions which nearly equals the theoretically achievable resolution limit (one Angstrom is a tenth of a nanometer, while a nanometer is one billionth of a meter). The TEM instrument is specifically designed for sub-Angstrom characterization of advanced materials and device structures, e.g. for atomic scale analysis of transistor gate areas, and will be made available to demanding customers in cutting-edge nanotechnology research and development. “We are highly impressed by the latest results in high-resolution TEM development achieved by Carl Zeiss SMT. Especially combined with its proprietary energy filter technology, this tool combines resolution and analytical capabilities required for successful process development and control of leading edge IC devices for current and future technology generations,” stated Dr. Udo Nothelfer, Vice President AMD Fab30 Dresden. “In addition to semiconductor industry requirements, artifact-free imaging at utmost resolution will also serve the world's growing nanotechnology community to characterize new devices and materials down to the atomic scale and even below, especially where non-periodic structures like crystal defects and interfaces become of increasing significance. By development of our sub-Angstrom resolution TEM, we enable our most demanding customers to enter the “magic” sub-Angstrom regime defining the key properties of materials," stated Jan Vermeulen, Marketing Director of Carl Zeiss SMT. For demonstration of the achieved image resolution, Young's fringes patterns have been generated from micrographs recorded at 800,000 times image magnification and image acquisition times of 1s. The energy spread of the field emission source was reduced by the monochromator to 0.2eV and a residual spherical aberration of the objective lens (Cs value) was obtained using the integrated aberration corrector from CEOS GmbH. An amorphous Tantalum thin film was used as specimen. Four ring insets, calibrated by gold lattice reflections, indicate the 1.0, 0.9, 0.8 and 0.7 Angstrom resolution limits (from inside to outside). For all image directions, the fringe contrast clearly extends to the 0.8 Angstrom ring and even extends to the 0.7 Angstrom ring for certain image directions. http://www.semiconductor-technology.com/contractors/metrology/carl_zeiss/press2.html Thu, 17 Mar 2005 16:38:08 GMT http://www.semiconductor-technology.com/contractors/metrology/carl_zeiss/press2.html Carl Zeiss SMT Exhibits at 2005 Semicon Europa Carl Zeiss SMT will be exhibiting at the major European semiconductor trade show Semicon Europa, 12 to 14 April 2005 in Munich, Germany. The Semiconductor Metrology Systems Division will present two product lines: AIMS mask qualification tools and MeRiT advanced mask repair tools. The unique AIMS™ family of Mask qualification tools which are used in mask shops around the globe. AIMS™ mask qualification is extremely time effective, no printing needed, and contributes significantly to yield enhancement. With new tools AIMS is now available for mask qualification directly in the fab to qualify the masks before defects causes substantial damages to production. The MeRiT™ MG E-Beam based mask repair tool now enables repair of mask features as small as 45nm and beyond without causing any adverse effects on the quartz substrate. After initial tests by the industry, the tool is now accepted as the instrument of choice for next generation mask repair tools. The Nano Technology Systems Division presents the award-winning CrossBeam 3D analysis FIB tool and the unique GEMINI FESEM failure analysis tool. Both tools enable extremely high resolution imaging and analysis to detect small defects. Also presented will be the MII range of S-FIL nano imprint tools which enable printing features down to 20nm with a wafer throughput up to 5wfs/h. Please stop by to inform yourself about the latest Imprio 250 tool - a real production tool. http://www.semiconductor-technology.com/contractors/wafer/axus/press2.html Wed, 28 Jul 2004 15:08:43 GMT http://www.semiconductor-technology.com/contractors/wafer/axus/press2.html Axus Technology and Berkeley Process Control Announce Service Partnership for Legacy CMP Tool Axus Technology and Richmond, California-based Berkeley Process Control, Inc. have announced the appointment of Axus Technology as a value added reseller for Berkeley products. Axus Technology, a global provider of equipment, parts and engineering services for chemical mechanical planarization (CMP), wafer cleaning and wafer-thinning equipment users, will offer Berkeley control systems and components used on existing equipment throughout Asia and North America. “Axus Technology's expertise in CMP process and Berkeley control products, combined with their relationships with semiconductor equipment end users, make an excellent fit in terms of providing world-class service to system users,” said Lenson Wong, director of marketing at Berkeley. Berkeley and Axus have completed several projects in support of customers who use the SpeedFam Auriga(R) product line. Axus Technology provides sales and engineering services to semiconductor fabs and maintains an inventory of Berkeley products for emergency support. “We are pleased to expand our partnership with Berkeley to provide the exceptional service and technical expertise expected by users of CMP tools - a critical part of fab operations worldwide,” said Barrie VanDevender, Axus Technology's vice president of sales and marketing. Both companies expect to continue to grow their relationship as additional cooperative opportunities are developed. Berkeley Process Control is a leading provider of flexible automation solutions to the semiconductor and other industries. Berkeley capabilities include multi-disciplinary engineering expertise to deliver motion, process and turnkey machine solutions. http://www.semiconductor-technology.com/contractors/wafer/axus/press1.html Fri, 09 Jul 2004 11:16:54 GMT http://www.semiconductor-technology.com/contractors/wafer/axus/press1.html Axus Technology and Strasbaugh Team to Offer Improved Carrier Performance for IPEC CMP Systems CHANDLER, Ariz., July 9, 2004 - A strategic partnership between Axus Technology, a global provider of semiconductor manufacturing equipment, parts, and engineering services for chemical mechanical planarization (CMP), wafer cleaning and wafer-thinning equipment users, and Strasbaugh has led to the release of Strasbaugh's established ViPPR™ carrier technology for retrofit on IPEC 472 &372M chemical mechanical planarization (CMP) tools. The ViPPR carrier provides for immediate improvements in process and yield performance. Key performance advantages include improving the edge exclusion to 3 mm, providing multi-zone back pressure, and optimal center-to-edge uniformity. The retrofit requires minimal downtime and no software changes. ViPPR is a field-proven carrier with more than 400 production installations. The retrofit for use on IPEC CMP tools will enable performance enhancements for more than 1,000 IPEC CMP tools worldwide. “With ViPPR II™ technology, the IPEC CMP systems will remain productive while providing better quality at substantially higher yields,” said Allan Paterson, senior vice president of sales and marketing. “Customers can gain the technology improvements offered by the ViPPR II without recapitalizing with today's multimillion-dollar CMP tools. They can upgrade an entire line with ViPPR carriers for less than the cost of one new tool.” The ViPPR carrier is available direct from Strasbaugh or as an upgrade on remanufactured tools purchased from Axus Technology. “The development partnership with Strasbaugh is a major success for Axus Technology,” said Dan Trojan, vice president of engineering at Axus Technology. “Delivering improved process performance to end users, while also improving yield and throughput, is an important part of our strategy. Axus' ability to provide these types of solutions for legacy tools is a result of our extensive OEM product development experience and our strong presence in the secondary equipment market.” Strasbaugh is an established supplier of precision surfacing solutions. The company offers a range of products related to planarization, polishing, and grinding technologies for use in semiconductor, optical and other technical fields. Axus Technology is a global supplier of equipments, parts, and engineering services for chemical mechanical planarization (CMP) and related technologies. http://www.semiconductor-technology.com/contractors/test/q-star Thu, 01 May 2008 00:00:00 GMT http://www.semiconductor-technology.com/contractors/test/q-star Q-Star Test Q-Star Test is the world-leading provider of advanced IDD-based test and measurement solutions, is a provider of Test and Design For Test (DFT) consulting and training services and also offers engineering services for the development of customized solutions. We offer standard and customized products and services that support a total-solution test strategy, consisting of measurement equipment, consulting services and training courses. Q-Star Test serves its customers with Test and DFT solutions, helping them to reduce test efforts and test costs whilst improving testability and product quality. Our products support standard as well as advanced IDD measurement strategies, such as various forms of Delta IDDQ, Current Ratios, and Relative IDDQ as well as transient current (IDDT) testing and current measurement-based tests for analog circuits. IDDX MONITOR PRODUCTS, TEST CONSULTING AND TRAINING SERVICES Q-Star Test has IDDX monitor products for: On-chip measurements of quiescent, transient and analog (supply) currents Power and ground connection / continuity verification "Plug-and-play" interface (loadboard - DUT board - probe card) applications; these are ATE independent solutions, enhancing the capabilities of existing ATE and offering a low-cost IDDX test technology entry point ATE integration We offer consulting and training services on: Test and Design For Test (DFT) Design For Test (DFT) methodologies Test strategy improvement Supply-current based DFT methodologies and techniques Supply-current test application and measurement strategies We offer engineering services for the development and realization of electronic measurement solutions and custom electronic modules or systems. Our plug-and-play loadboard monitor products provide an easy way to implement a supply-current test strategy in an existing production environment. LOADBOARD, BUILT-IN CURRENT AND ATE MONITOR MODULES Loadboard monitor modules are plug-and-play single chip monitors or small monitor modules, to be placed on the interface board, loadboard, DUT board or probe card, providing ATE independent advanced IDD measurement solutions and extending the ATE functionality. Q-Star Test offers the following types of loadboard monitors: Monitors for digital (IDDQ applications: QD-1000, QD-1010, QD-1011, QD-1010HC and QD-1020 - the QD-1000 is a single chip pass/fail IDDQ monitor with analog value read-back option and voltage or current based pass/fail reference setting and is offered with a QI-000x support module The QD-1010, QD-1011, QD-1010HC and QD-1020 are IDDQ monitor modules with pass/fail and digital value read-back option, digital pass/fail reference setting, on-board data processing capabilities and support various Delta-IDD and other advanced IDD test strategies - the QD-1010 and QD-1011 cover the 0mA to 30mA range, the QD-1010HC is designed for high current ranges (50mA to 2A) and the QD-1020 is a QD-1011 adapted for multi-site applications with resource sharing Monitors for transient / dynamic current measurements: QT-1400 and QT-1410; the QT-1410 offers a wide measurement range, high resolution, 50MHz sampling rate and digital interface and makes concurrent peak, charge and pulse-width measurements in its default configuration Monitors for analogue applications: QA-1000 and QA-1000HC Built-in current monitors are IP building blocks that are integrated on the same silicon with the circuit to test. These monitor types comprise: the BICMON range of quiescent supply current monitors, the T-Mon series of transient current monitors and PG-Mon, a power-ground connection verification monitor. ATE monitor modules are designed for integration into ATE or other test equipment. Prototypes are available, e.g. quiescent supply current monitors and transient / total supply current monitors. TEST AND DESIGN FOR TEST (DFT) CONSULTING AND TRAINING SERVICES Q-Star Test's consulting and training services are designed to shorten learning circles, improve productivity and to assist with the implementation of proper design for test and design for manufacturing flows. Our design-oriented consulting services address the following main themes: Test background, fault models and test pattern generation Design for Test methodologies and their application IDDQ related design, design for test techniques and IDDQ test pattern generation Optimization of supply-current test-based test pattern generation Use of built-in current monitors Consulting services for test engineering and production testing include support for: test strategy improvement, supply-current test strategies and implementation, and IDDX-based test optimization. Training services cover topics including, but are not limited to: "An introduction to Test and Design for Test for designers", “What is test all about?", “Fault modeling and test pattern generation", "Design for Test methodologies and their application", as well as "IDDX Design for Test strategies", "IDDX test strategies" and "IDDX test implementation". ENGINEERING SERVICES Our engineering services support the design, development, prototyping, production preparation and eventual small series production of electronic measurement solutions and other custom electronic modules or systems. With Q-Star Test, you get more than just technology. Behind our solutions stands an experienced team that knows your problems, needs and expectations! For more information: http://www.semiconductor-technology.com/contractors/sensors/cosense Wed, 20 Feb 2008 00:00:00 GMT http://www.semiconductor-technology.com/contractors/sensors/cosense Cosense Cosense, Inc. is a highly innovative company using ultrasonic technology in the pharmaceutical, biomedical and semiconductor industries. Cosense has been the front runner for special level-problem solving, in semiconductor fluid-handling, wafer counting, wafer profiling, wafer alignment, wafer flatness, buckling, and gripping. Fluid handling level sensors are designed to monitor liquid level in chemical delivery systems, acid and solvent tanks, wafer preparation and etching equipment, gas scrubbers, and monitoring of high purity chemicals in a stainless steel canister. Cosense Sonic Eye™ series non-invasive level sensors detect fluid level as a high / low alarm in metal, glass and plastic containers with a disposable or reusable sensor, which eliminates the problem of fluid contamination. For over 20 years, Cosense's design, development and manufacturing team has provided solutions to many level measurement challenges using an innovative approach with quality, reliability and cost effective solutions for OEM and private label customers. The company's product portfolio includes ultrasonic invasive / non-invasive discrete single / multipoint and continuous level sensors, air bubble and particle detectors, flow / no flow detectors, and low flow metering devices. ML-101 SERIES ULTRASONIC MICRO-MEASUREMENT LEVEL SENSORS Cosense ML-101 series 'through air ultrasonic', non-contact, miniature sensors are as small as 7.8mm in diameter. They offer precision level measurement, verification, and inspection solutions for semiconductor fluid handling of high purity liquid / gas delivery systems, or wafer etching process, with a measurement accuracy of ±0.0002in (±0.005mm). The ML-101 series level applications include wafer alignment, flatness of wafer, wafer profiling, counting, and position safety. The ML-101 series precision level-measurement system is available from a single channel to multiple channels up to 24 channels (12 standard) for scanning, or multiple point robotic applications. SONIC EYE ™ NON-INVASIVE LIQUID LEVEL SENSOR SERIES The non-invasive Sonic Eye™ sensor monitors liquid levels at one or more points through a metal, glass, plastic pipe or container of various sizes, from ¼in (6.35mm) to 12in (305mm), and shapes. The exclusive patented reusable or disposable sensor design simply mounts on the container's outside wall without interrupting the process and also eliminates fluid contamination problems. The non-invasive level sensor is designed with an integral microprocessor based electronics circuit. Custom design sensors are available for battery operation with 3.3V, 1mA current consumption. LIQUID LEVEL SENSORS IN CANISTERS / BUBBLERS CARRYING HIGH-PURITY CHEMICAL FLUIDS Precursors for use in semiconductor fluid handling equipment are supplied in high integrity, stainless steel containers for purity and safety. To make the system independent of usage calculations, Cosense has introduced the SL-700/SL-900 series of ultrasonic liquid level sensors to monitor, in real time, liquid level accurately to within ±0.5mm of ultra pure chemical fluids. Its miniature sensor design, with no moving parts, eliminates particle generation with a reduced liquid volume displacement. Chemical fluids include, but are not limited to CVD, ALD, DMAH, TAEO, TDEAT, TEOS, DCE, TCA, and BHD-111. The sensor output can be utilized for an automatic refill function of chemical fluids in wafer cleaning and etching operations. The electronic module is available with a variety of input and output options including an RS-232 interface. ULTRASONIC NON-INVASIVE AIR-IN-LINE, AIR BUBBLE AND PARTICLE DETECTOR Cosense AD-101 Series ultrasonic non-invasive air bubble and particle detectors have a wide range of applications for the detection of air bubbles and particles in fluid-lines in the wafer etching process as well as in coolant lines. Undetected air or absence of fluid can cause a major problem in the wafer manufacturing process. The AD-101 ultrasonic sensor simply clamps on the outside of the tubing wall, eliminating liquid contamination problems. Standard sensors can detect air bubbles as small as 500 microns in size in tubing from 1mm to 12mm. All standard flexible and rigid tubing, including Teflon® can be accommodated. Integral electronics offer a variety of output options including RS-232. Custom sensors for OEM customers can be designed to measure air bubbles down to 100 microns in size. http://www.semiconductor-technology.com/contractors/process/tec-sem Wed, 11 Jul 2007 00:00:00 GMT http://www.semiconductor-technology.com/contractors/process/tec-sem Tec-Sem Tec-Sem, founded in 1981, is one of the pioneers in cleanroom automation. The company was strongly involved during the conversion from 6in to 8in wafer processing in 1986 and also in the introduction of 300mm automation equipment in 1996. In 1994, Tec-Sem introduced the first bare reticle storage systems to the market which today are industry standard. Tec-Sem offers a wide range of automation systems for cleanroom applications such as single wafer management systems, fab automation and logistic systems as well as wafer loading systems for batch process equipment. Thanks to the more than 20 years' experience in developing wafer handling systems, Tec-Sem is a well-trusted partner in the semiconductor industry. SINGLE WAFER MANAGEMENT SYSTEMS Today, wafers in the fabs are still stored in wafer containers as batches on shelves or in cassette stockers. Specifically for small production or test lots, the management of these wafers in cassette batches is far from optimal. Very long wafer access times, huge floor-space consumption and too much wafer and cassette traffic are the problems created by this batch handling. These problems can be eliminated by the full integration of bare wafer storage with single wafer sorting into one single tool (single wafer management system). The graph on the right-hand side illustrates the differences. The performance difference between today's batch-based logistics and Tec-Sem's single wafer management systems can be easily proven when looking at a realistic example of a lot split from 12 wafers out of a mother FOUP into six child FOUPS (one cassette transfer is assumed as 5mins). Tec-Sem decided to offer completely new products to the market which integrate the sorter functionality with bare wafer storage capability on minimum floor space. The first so-called single wafer management system for 300mm wafers was installed already in 2001 and today different fabs are using this technology with great success. Interest in this new technology is rapidly picking up speed. The latest product of the single wafer managers is the new Pr@ctor sorter / stocker. IMPROVED WAFER STORAGE QUALITY AND N2 PURGING Another important aspect for future fabs will be the improvement in cleanliness in wafer handling and storage. The new, patent-pending bare wafer storage technology of Tec-Sem allows the creation of so-called Micro Cleanrooms inside the stocker area. This again allows storage of the wafer under extremely clean and controlled conditions (ISO1) as well as separation of different wafer categories which should not be mixed. Also, the possibility of purging all or part of the wafers in the stocker is increasingly important. WAFER TRACKING AND HOST INTEGRATION Lastly, the full integration into the existing factory control systems (MES) is crucial to guarantee data integrity and history tracking in the fab. Individual or multiple single wafer management systems can be linked either directly to the fab MES or through a separate, single wafer capable middle-ware software (WSM). CUSTOMER VALUE AND PAYBACK Every investment must be justifiable by a quick return on investment. The Tec-Sem single wafer management systems are already proven in different leading 300mm fabs and offer clear savings potentials in the following areas: Reduced investments in equipment, floor-space and cassettes Avoidance of unnecessary traffic reduces load on MES and AMHS systems Much faster wafer access time reduces waiting times Highly improved wafer storage quality with Micro Cleanroom technology and N2 purging Different systems for 200mm and 300mm wafers with different capacity up to 2,700 wafers Seamless integration into fab control systems and 100% single wafer history tracking http://www.semiconductor-technology.com/projects/samsung300/ Mon, 11 Sep 2006 00:00:00 GMT http://www.semiconductor-technology.com/projects/samsung300/ Samsung Electronics 300mm Fab Plant Samsung Electronics is constructing a 300mm wafer fab in Austin, Texas. This, the first 300mm fab in central Texas, will produce DRAMs and other devices. The fab will cost around $3.5bn, with Texas having offered Samsung over $230m in tax abatements and other incentives. This was however apparently less than half the amount offered by New York, which was also interested in hosting the new plant. Production should begin by late 2007 or early 2008, although it will take several years to completely outfit the factory. The plant adds to Samsung's existing 200mm DRAM fab at Austin, opened in 1998. Samsung bought around 120ha (300ac) of land when it set up the 200mm plant, giving room for a $500m expansion and upgrade in 2002. This fab covers over 61,000m² (660,000ft²). "The fab will be the area's first new semiconductor plant to open since the original 200mm Samsung fab in 1998." The 300mm plant will cover at least three times this area, but there is still room for considerable expansion at the site. Samsung already employs about 1,200 people in Austin, with around 900 new jobs being added at the new fab. RANGE OF MEMORY DEVICES Samsung produces a range of memory devices, including DDR2, XDR DRAM, SDR / DDR AND SDRAM. The DDR2 DIMMs store from 256MB to 2GB. They are based on Samsung's 512Mb DDR2 components, and made in an advanced 10-micron process. Samsung's XDR DRAMs have up to 8.0GB/s sustained bandwidth. They are organised in eight banks, with efficient operation for different bank sets (even / odd). There is zero refresh overhead. The memory fits in video console games, digital televisions, computer servers, workstations and other applications requiring high bandwidth and low latency. The devices bring high system memory bandwidth for processors, multimedia and 3D graphics. Mobile-SDR / DDRs consume less power than normal synchronous DRAMs, with Samsung offering 1.8V, 2.5V or 3.0V supply. Special functions include PASR (Partial Array Self Refresh) and internal automatic TCSR (Temperature Compensated Self Refresh), which extend battery life both during operation and on standby mode. Conventional DRAM is operated by a separate controller independent from computer system operation, and finds it difficult to keep up with faster CPUs. SDRAM (Synchronous DRAM) processes data at the same speed as the system clock. That makes it excellent for high speed processing of large volume data. SDRAM has been used for PCs, servers and networks, and is now being used in consumer equipment like printers, digital cameras, hard disk drives and set-top boxes. FIRST FAB IN AUSTIN FOR SOME YEARS The decision to locate the 300mm fab in Austin was greeted with some relief in the area, since there has been a slide in semiconductor-related employment in central Texas over the last ten years. "Production should begin by late 2007, although it will take several years to completely outfit the factory." The fab will be the area's first new semiconductor plant to open since the original 200mm Samsung fab (making high-speed memories for PCs and servers) in 1998. Samsung worked with Austin officials for 16 months before announcing the decision. The company was concerned about the lack of direct flights from Austin to Seoul, meaning that finished wafers must be sent via the Dallas air freight terminal. The I-35 highway between Austin and Dallas is often busy, adding delays to shipments destined for Korea for final assembly and testing Samsung sought reassurances about congestion on and around the I-35 over the next ten to 15 years. The nearness to the University of Texas was an attraction, making it easier for Samsung to recruit future engineers. In 2005, Austin attracted Freescale Semiconductor's headquarters and a consolidation of Advanced Micro Devices' campus. This has offset the drop in semiconductor related employment from 25,000 in 2000 to about 15,000 now. LARGEST EVER FOREIGN INVESTMENT IN A US FACTORY The plant is thought to be the largest investment by a foreign company in an American factory. Samsung's existing 200mm fab was Samsung's only semiconductor plant outside South Korea. Without the new investment, this plant would have become less and less viable as it reached the end of its useful life. The announcement also makes future expansion in Austin much more likely. Samsung has clustered manufacturing operations before with a $33bn expansion now underway that will create the world's largest semiconductor complex in the Korean cities of Giheung and Hwaseong. This will be the world's largest semiconductor complex when completed in 2012. http://www.semiconductor-technology.com/projects/nokia/ Mon, 11 Sep 2006 00:00:00 GMT http://www.semiconductor-technology.com/projects/nokia/ Nokia Mobile Phone Production Facility Nokia has chosen Chennai in the state of Tamil Nadu, Southern India, for its tenth mobile phone factory. The facility will cost up to $150m over three years, and will make entry-level, mid-level, and top-end GSM (Global System Mobile) and CDMA (Code division multiple access) handsets for the Indian market. The plant is located at Sriperumbudur, about 50km west of Chennai, on an 85ha (210ac) plot. Construction began in April 2005, and production in March 2006. Nokia is building up the factory gradually, with small quantities of a basic entry-level handset ironing out any initial production glitches. By the end of 2006, Nokia should have about 2,000 employees at the site. "Nokia received state assistance after different Indian states competed against each other for the plant." PRODUCTION STARTS WITH 1100 HANDSET Nokia started production with its 1100 handset, which has in-built flashlight and is aimed at the Indian market. The 1100 accesses calling, messaging, and menu functions across a navi key silicon keymat. Up to four lines of text messaging are shown on a two-way scroll display showing 96x65 pixel black-and-white images. Font size is selectable and an internal phone book stores up to 50 entries. There is vibration alert, date and time screensaver, and a reminder function. Several other functions are built in, including alarm, stopwatch and countdown timer. Nokia's CDMA phones include the 6235, which captures and views images with an integrated VGA camera and video recorder. It connects to the internet via a WAP 2.0 browser to share images, or for news and entertainment. It also allows features like voice recording for ringtones. The company is expanding mobile voice and data capabilities across a wide range of mobile devices. Nokia primarily targets high-volume mobile phones and devices based on GSM / EDGE, 3G / WCDMA and CDMA global cellular technologies. Increasingly, products are including megapixel cameras, music players and advanced-quality colour screens. NEARLY TWO BILLION SUBSCRIBERS WORLDWIDE The world's mobile subscriber base is now running at around two billion. Sales in Asia Pacific will take a growing share, and India is a central location for production. There are already around 100 million wireless customers in India, with yearly sales rising to nearly 50 million. The Indian Government expects telecom manufacturing to soon hit $1bn. Nokia leads with nearly 50% of the country's $2.5bn handset market, followed by companies like Samsung, LG Electronics and Motorola. Manufacturing capacity in the country is rising, with Elcoteq starting manufacturing in Bangalore shortly before Nokia made its own announcement. A SKILLED LOCAL LABOUR FORCE The whole complex is being constructed by Leighton Contractors (India) in a $35m contract. A 23,000m² steel-framed building houses the two major production halls as well as offices, warehouses and locker areas. Leighton is supplying electrical, air-conditioning, water treatment and sewerage infrastructure. It will also build associated roads and car parks. "The facility will make entry-level, mid-level, and top-end GSM and CDMA handsets for the Indian market." Chennai has a skilled labour force, with support from the state government and good logistics connections. Nokia received state assistance after different Indian states competed against each other for the plant. The company is also trying to persuade its suppliers to set up in India to simplify logistics, and the plant itself will have units reserved for suppliers. They will supply components like keypads, covers and other plastic and metal parts. Nokia's regional corporate headquarters are located at Alexandra Technopark in Singapore. Nokia Mobile Phones manufactures products out of three major facilities in Masan, Korea, and Beijing and Dongguan in China. There are R&D centres in Japan and China, and an industrial park in Xingwang (Beijing) with R&D and manufacturing facilities. Nokia Networks has technology and training centres in Australia, Japan and Thailand, as well as six joint ventures in China. Nokia reports that total investment in a facility in China that similar to the Chennai plant has reached over $1bn over seven years. http://www.semiconductor-technology.com/projects/toshiba-production/ Thu, 18 May 2006 00:00:00 GMT http://www.semiconductor-technology.com/projects/toshiba-production/ Toshiba 300mm Wafer Fab, NAND Flash Memory Fab-4 Toshiba Corp. and SanDisk are building a new 300mm wafer fabrication facility at Toshiba's Yokkaichi operations in Japan. The companies plan to start construction of the new facility, called Fab-4, in August 2006. Initial production operations are scheduled to begin in Q4 2007. Toshiba will fund construction of the building, while both Toshiba and SanDisk will provide funds for the manufacturing equipment. Fab-4 will be similar in size to the companies' Fab-3 300mm plant currently also operating at Yokkaichi. Toshiba has increased its capital-spending budget several times over the last year, partly to fund expansion at Fab-3 and partly to fund Fab-4. In 2005, Toshiba announced an increase in capacity at Fab-3 from 10,000 to 30,000 300mm wafers/month: 40% higher than previously planned. That took an investment of nearly ¥40 billion (about $350 million), evenly shared between the companies. The two companies jointly invested an additional $1.5 billion in February. That should take the output at Fab-3 to nearly 50,000 wafers/month by the second half of 2006. The companies cited the continued growing demand for NAND flash as the reason for the expansion. Together, the two fabs should meet the demand for NAND flash memory products beyond 2008. TOSHIBA AND SANDISK JOINT VENTURE In December 2001, Toshiba and SanDisk announced a Memorandum Of Understanding to consolidate their NAND flash wafer fab manufacturing operations. In December 2002, they announced relocation of their joint FlashVision venture from the Dominion Semiconductor facility in Manassas, VA, to Toshiba's semiconductor plant at Yokkaichi. The aim at the time was to increase production capacity and speed time to market for volume production of the companies' 0.13-micron NAND flash memories. Production at FlashVision Japan started in 2002, with production ramp up in 2003. Toshiba had previously made 0.16-micron NAND flash wafers at the Yokkaichi facility. The consolidation of manufacturing at Yokkaichi streamlined the technology transfer for highly cost competitive MLC (Multi-Level Cell) NAND and 0.13-micron devices. In 2004, Toshiba and SanDisk began constructing the 300mm fab at Yokkaichi. Mass production began in Toshiba's financial year 2005 (brought forward from FY2006). The total investment in Fab-3 at Toshiba's Yokkaichi operations has been around ¥200 billion (nearly US$2 billion) up to the end of FY2005. The facility is operated by FlashVision. Initial production at Fab-3 used a 90nm process, and this is migrating to the 70nm process jointly developed by Toshiba and SanDisk. Output is equally shared between Toshiba and SanDisk. The fab still has space to expand capacity, and further investment could take output to as high as 62,500 wafers/month. The 300mm fab is also slated to mass-produce NAND flash memory based on 55nm processes in late 2006. Toshiba now has a monthly capacity of 450 million (counted in 64Mbit parts) NAND flash memory chips. Capacity will be increased to 750 million units when processes shift to 55nm. Environmentally conscious design reduced emissions of carbon dioxide and perfluorocarbons from the clean room in Fab-3, while the energy consumed in wafer processing is 30% lower than that in Toshiba's 200mm wafer clean rooms. As announced, Fab-4 will be similar to Fab-3, which is a five-story building with site area of 24,300m², floor area of 113,000m², and clean room area of 34,500m². There are around 1,950 employees at the site. Total site area is around 312,000m², and total building area is around 180,000m² excluding Fab-3 and Fab-4. LONG-TERM COOPERATION Non-volatile NAND flash memory was invented by Toshiba, and stores data for various mobile products including digital still cameras and multimedia mobile phones. The strategic partnership with US-based SanDisk brought the experience of a leading memory card maker with expertise in high-density flash memory and MLC NAND. SanDisk is the world's largest supplier of flash data storage products. It designs, manufactures and markets industry-standard, solid-state data, digital imaging and audio storage products. SanDisk is based in Sunnyvale, CA. Flash Partners, Ltd., a Toshiba-SanDisk venture established in September 2004, is 50.1% owned by Toshiba and 49.9% by SanDisk. The NAND-FLASH market more than doubled between 2003 and 2006. The price of NAND flash chips however dropped dramatically in 2005 (by around 60%). Toshiba said it expects demand will help boost pricing within an acceptable range. SPECIFICATION - TOSHIBA FAB AT YOKKAICHI JAPAN