FOBA Presents Novel and Small-Sized Marking Laser at Hannover Messe 2012
From 23 to 27 April 2012, FOBA, international market and technology leader of systems and integrated solutions for laser marking and engraving, will exhibit at Hannover Messe in Germany.

FOBA Introduces New Brand Presence
FOBA, manufacturer of systems and machines for laser marking and laser engraving, presents its new look and feel.

M+W Group Wins Major Contract for New Infineon Semiconductor Plant in Malaysia
The global engineering and construction company M+W Group has received a major contract from Infineon Technologies for a new semiconductor plant in Kulim, Malaysia.

Rudolph Enters New Market for Metrology in Back-End Packaging
Rudolph Technologies, a leading provider of process characterisation equipment and software for the semiconductor, LED and solar industries, has announced that it has delivered the first MetaPULSE® metrology system for measurements of under bump metallisation (UBM) and redistribution layers (RDL) used in advanced packaging technologies in the back-end of the integrated circuit (IC) manufacturing process.