www.semiconductor-technology.com
News, views and contacts from the global Semiconductor industry
Weekly Round Up
26 September 2017
Latest Companies

OEM Group, LLC - New and Remanufactured Semiconductor Capital Equipment

SCHMITT - Chemical-Resistant Pumps for Semiconductor and Solar Wet Process Equipment

Berkshire Corporation - Cleanroom Supplies for Semiconductor, FAB and Controlled Environments

Dycem - Contamination Control Flooring for the Semiconductor Industry

PiezoMotor - Piezoelectric Motors for the Semiconductor Industry

Press Releases

New US Sales Office Launched by Dycem
Dycem Contamination Control has announced the establishing of a new US sales office in Texas.

Sterilising Cleanroom Floors and Walls
Sterilising the floors and walls of a cleanroom requires specific equipment and techniques for a high-efficiency process.

Should We Resist the Rise of the Robots?
When investigating the rise of the robot in the cleanroom, we looked at the roots of automation in the late nineteenth and early twentieth century's second industrial revolution.

Balance Between Robots and Human Personnel
It is nothing new that technology constantly grows and changes.

#SizeMatters: Risk Matters Campaign
Dycem flooring is more effective than peel-off mats for meeting cleanroom protocols.

White Papers

Chemical Resistant Pumps
Schmitt offers a wide range of chemical-resistant pumps for corrosive and hazardous...

Berkshire Sterile Cleanroom Management
Consumables such as wipers, tubing, swaps, and gloves must not contaminate the...

Cleanrooms | Aseptic Processing | Controlled Environments
A breakthrough patented wiper technology from Berkshire, CapSure® features an innovative surface treatment process that enables wipers to capture and retain more contaminant...

Critical Containment Control Solutions
Dycem is a world leading manufacturer and supplier of contamination control floor solutions for critical environments. The products are solely manufactured in Bristol, UK, and are sold globally...

Critical Containment Control Comparison
Air, foot and wheel contamination in manufacturing, processing and storage areas can have an impact on many aspects of business, interrupting production, reducing product yields and in...

Features

A Shared Vision
Gail Purvis presents an exclusive preview of a round-table workshop planned for the Global Semiconductor Forum. She discusses the issue of collaborative innovation with keynote speakers and industry heads.

ERM – The Crucial Questions
Michael Garner of Intel answers the crucial questions on emerging research materials (ERM).

ERM – The Challenges
Michael Mayberry of Intel tells us about emerging research devices already delivering the goods.

Small Wonder
Chips are now so complex that electronic design automation is vital for future performance. Jim Banks speaks to Michael J Fister, the president and CEO of Cadence Design Systems, about the complexities of working at the nanometre scale to increase performance and functionality.

Innovation Revolution
Dragan Boscovic of Motorola, informs Gail Purvis about the continuing evolution of the mobile phone. He tells us what technological advances to expect in the future and how scientists are dealing with the problem of adding features to devices while reducing power consumption.

Projects

Nokia Mobile Phone Production Facility
Nokia has chosen Chennai in the state of Tamil Nadu, Southern India, for its tenth mobile phone factory. The facility will cost up to $150m over three years, and will make entry-level, mid-level, and top-end GSM (Global System Mobile) and CDMA (Code division multiple access) handsets for the Indian market.

Samsung Electronics 300mm Fab Plant
Samsung Electronics is constructing a 300mm wafer fab in Austin, Texas. This, the first 300mm fab in central Texas, will produce DRAMs and other devices.

Toshiba 300mm Wafer Fab
Toshiba Corp. and SanDisk are building a new 300mm wafer fabrication facility at Toshiba's Yokkaichi operations in Japan. The companies plan to start construction of the new facility, called Fab-4, in August 2006. Initial production operations are scheduled to begin in Q4 2007.

AMD Saxony 300mm Semiconductor
AMD’s 300mm 65nm fab in Dresden, Germany, is one of Europe's largest semiconductor manufacturing facilities. The new facility is located next to AMD's existing main microprocessor fab, Fab 30.

Elpida Memory
Elpida Memory and Hiroshima Elpida Memory have constructed a second 300mm wafer fab in Hiroshima. The new 300mm DRAM (Dynamic RAM) plant was built next to the company's first 300mm facility and began mass production at the end of 2005. Elpida introduced 85nm processing at the new facility soon afterwards.


Follow Us:

Click here to unsubscribe from the newsletter

You are receiving this email because you are either a valued subscriber to Semiconductor Technology or have signed up via a partner web site. Your email address has not been, and will not be, given to third parties.

Kable, a trading division of Kable intelligence Limited|Registered office: John Carpenter House, John Carpenter Street, London, EC4Y 0AN | Registered in England No. 03171601