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AMD Saxony 300mm Semiconductor

Organization

AMD Saxony

Location

Dresden, Germany

Type of facility (technologies)

CMOS

Project cost

$2.45 billion over four years

Financing

$700 million from bank consortium, $300 million from investors, $500 million in government grants, with the rest from AMD

Lead private investor

M+W Zander

Ground breaking

Nov 2003

Completion

2005

Qualification

H2 2005

Operation

2006

No of employees

1,000+ direct jobs and an extra 1,000+ jobs in the region

Wafer size

300mm

Feature size

65nm

Throughput

Initial capacity 13,000 wafers/month, up to 20,000 wafers/month

Applications

Computing, communications and consumer electronics
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Project Overview



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