Specifications - AMD Saxony 300mm Semiconductor Manufacturing Facility (FAB 36), Dresden, Germany
| Key Data | |
|---|---|
| Organization | AMD Saxony |
| Location | Dresden, Germany |
| Type of facility (technologies) | CMOS |
| Project Details | |
| Project cost | $2.45 billion over four years |
| Financing | $700 million from bank consortium, $300 million from investors, $500 million in government grants, with the rest from AMD |
| Lead private investor | M+W Zander |
| Ground breaking | Nov 2003 |
| Completion | 2005 |
| Qualification | H2 2005 |
| Operation | 2006 |
| No of employees | 1,000+ direct jobs and an extra 1,000+ jobs in the region |
| Process Details | |
| Wafer size | 300mm |
| Feature size | 65nm |
| Throughput | Initial capacity 13,000 wafers/month, up to 20,000 wafers/month |
| Applications | Computing, communications and consumer electronics |
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