Project Category : Assembly
LATEST INDUSTRY PROJECTS IN ASSEMBLY
ChipPAC
ChipPAC has announced its intention to build a facility that...
- ChipPAC Assembly and Test Facility, Shanghai, China
- Fairchild Assembly and Test Facility, Suzhou, China
- Motorola Flip-Chip and QFP Packaging and Testing Facility, Petaling, Malaysia
- National Semiconductor Analog Assembly and Test Expansion, Suzhou, China
- Nokia Mobile Phone Production Facility, Chennai, India
- Optoelectronics Packaging Centre, Livingstone, United Kingdom