Project Category : Assembly
LATEST INDUSTRY PROJECTS IN ASSEMBLY
Nokia Mobile Phone Production Facility,
Nokia has chosen Chennai in the state of Tamil Nadu, Southern...
Nokia has chosen Chennai in the state of Tamil Nadu, Southern...
National Semiconductor Analog Assembly
National Semiconductor Corporation is shipping products from...
National Semiconductor Corporation is shipping products from...
Optoelectronics Packaging Centre,
A £4.2 million facility to develop new packages for optoelectronic...
A £4.2 million facility to develop new packages for optoelectronic...
Motorola Flip-Chip and QFP Packaging
Motorola has completed the first phase of a $66 million, 18-month...
Motorola has completed the first phase of a $66 million, 18-month...
Fairchild Assembly and Test Facility, Suzhou
Fairchild Semiconductor complete the first phase of its 80,000m²...
Fairchild Semiconductor complete the first phase of its 80,000m²...
- ChipPAC Assembly and Test Facility, Shanghai, China
- Fairchild Assembly and Test Facility, Suzhou, China
- Motorola Flip-Chip and QFP Packaging and Testing Facility, Petaling, Malaysia
- National Semiconductor Analog Assembly and Test Expansion, Suzhou, China
- Nokia Mobile Phone Production Facility, Chennai, India
- Optoelectronics Packaging Centre, Livingstone, United Kingdom
