Projects By Category: Assembly
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Latest Industry Projects in Assembly
ChipPAC has announced its intention to build a facility that will more than double the company's capacity at its site in the Qingpu District of Shanghai. Planned to begin Q3 2003, the facility...
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Motorola Flip-Chip and QFP Packaging
Motorola has completed the first phase of a $66 million, 18-month technology transfer and capacity expansion at its Motorola Malaysia Sdn Bhd (MMSB) plant. Phase one was completed in August...
National Semiconductor Analog Assembly
National Semiconductor Corporation is shipping products from its Suzhou Industrial Park facility to customers in China and abroad. Suzhou is National’s first manufacturing facility in China....
Projects In Assembly Alphabetically