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ChipPAC

Organization

ChipPAC, Inc.

Location

Shanghai, China

Type of facility (technologies)

Assembly and test

Project cost

ChipPAC has invested more than $150 million in manufacturing capabilities in China

Area

30,000m²

Target completion

Q3 2003

No of employees

Currently 2000 - expansion could double headcount

Throughput

More than 10 million units per day

Applications

Wireless, broadband, mobile, automotive and consumer equipment

Die preparation

Disco, Teitoku, Nomura, NGK Filtech, Takatori, Lintec

Die attach

K&S, ESEC, Blue-M, Alteq, Alphasem

Wire bonding

Shinkawa, K&S

Mold

Towa, Fico, ASM, Fuse, Blue-M

Ball mount

Winstat, JIT, Koese, Vitronics Soltec, BU-IL

Marking

Dongyang, EO Tech, GPM, JIT, HEI, Dysec

Metal finish

Meco, Tamura

EVI

Micro Vision, RVSI, Ever Tech, Softex, Starrett

Test equipment

Includes Eagles, LTX's, Teradyne A58X, Epro, Credence Quartets and Genesis
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Project Overview



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