ChipPAC Assembly and Test Facility, Shanghai, China
Key Data:
Organization
ChipPAC, Inc.
Location
Shanghai, China
Type of facility (technologies)
Assembly and test
Project cost
ChipPAC has invested more than $150 million in manufacturing capabilities in China
Area
30,000m²
Target completion
Q3 2003
No of employees
Currently 2000 - expansion could double headcount
Process Details:
Throughput
More than 10 million units per day
Applications
Wireless, broadband, mobile, automotive and consumer equipment
Die preparation
Disco, Teitoku, Nomura, NGK Filtech, Takatori, Lintec
Die attach
K&S, ESEC, Blue-M, Alteq, Alphasem
Wire bonding
Shinkawa, K&S
Mold
Towa, Fico, ASM, Fuse, Blue-M
Ball mount
Winstat, JIT, Koese, Vitronics Soltec, BU-IL
Marking
Dongyang, EO Tech, GPM, JIT, HEI, Dysec
Metal finish
Meco, Tamura
EVI
Micro Vision, RVSI, Ever Tech, Softex, Starrett
Test equipment
Includes Eagles, LTX's, Teradyne A58X, Epro, Credence Quartets and Genesis
