Elpida Memory 300mm Wafer Fab, Hiroshima, Japan
Key Data:
Organization
Elpida Memory, Inc. and Hiroshima Elpida Memory, Inc.
Location
Hiroshima, Japan
Type of facility (technologies)
CMOS
Project Details:
Project cost
Total construction cost is estimated at ¥450 billion to ¥500 billion
Area
90,870m²
Start date
10 June 2004
Completion
December 2005
Process Details:
Wafer size
300mm
Feature size
85nm soon after opening
Throughput
60,000 wafers/month maximum
Applications
Servers, mobile / cellular and consumer equipment, PCs, PDAs
