IBM 300mm CMOS Fab, East Fishkill, NY, USA
Key Data:
Organization
IBM Microelectronics
Location
East Fishkill
Type of facility (technologies)
300mm CMOS
Project cost
$2.5 billion
Area
14,000m²
Target completion
Now ramping up
No of employees
1,000 extra
Process Details:
Wafer size
300mm
Feature size
90nm
Throughput
500-600 wafers/day
Applications
Many, from mainframes, servers and supercomputers to cellular phones and home game consoles.
