Intel 90nm / 65nm Wafer Fab, Leixlip, Republic of Ireland
Key Data:
Organization
Intel
Location
Fab 24, Leixlip, Ireland
Type of facility (technologies)
CMOS
Project Details:
Project cost
$2 billion
Area
6,000m² manufacturing cleanroom space
No of employees
More than 5,000 after the new expansion
Completion
2006
Process Details:
Wafer size
300mm
Feature size
65nm
Technology
Strained silicon, 8-layer copper interconnects, and low-k dielectrics
Applications
Desktops, notebooks, communications, handhelds, servers, workstations
