Semiconductor Technology is using cookies

We use them to give you the best experience. If you continue using our website, we'll assume that you are happy to receive all cookies on this website.

ContinueLearn More X
X

Memscap MEMS Wafer Fab, Bernin

Organisation

MEMSCAP SA

Location

Bernin, France

Type of facility (technologies)

MEMS

Project cost

$55 million

Area

5,900m²

Completion

September 2002

Wafer size

6in and 8in wafers

Capacity

Eventually above 4,000 wafers/month

Process types

Bulk micromachining, surface micromachining and LIGA

Feature sizes

From 10 microns to 10mm

Materials

Silicon, quartz, polysilicon, silicon nitride, silicon dioxide, polyimides

Applications

Next-generation wireless communications, optical communications, and sensors for aerospace, biomedical and other applications
Expand

Project Overview



Related Articles

Go Top