Memscap MEMS Wafer Fab, Bernin, France
Key Data:
Organisation
MEMSCAP SA
Location
Bernin, France
Type of facility (technologies)
MEMS
Project Details:
Project cost
$55 million
Area
5,900m²
Completion
September 2002
Process Details:
Wafer size
6in and 8in wafers
Capacity
Eventually above 4,000 wafers/month
Process types
Bulk micromachining, surface micromachining and LIGA
Feature sizes
From 10 microns to 10mm
Materials
Silicon, quartz, polysilicon, silicon nitride, silicon dioxide, polyimides
Applications
Next-generation wireless communications, optical communications, and sensors for aerospace, biomedical and other applications
