Motorola Flip-Chip and QFP Packaging and Testing Facility, Petaling, Malaysia
Key Data:
Organization
Motorola Inc
Location
Petaling Jaya, Malaysia
Type of facility (technologies)
Assembly and test: CMOS microprocessors, CMOS logic, CMOS memory, Bi-CMOS, GaAs
Project cost
$16 million
Area
Adds more than 9,000m² of manufacturing area to the existing 70,000m² on an eight hectare site
Target completion
August 2002
No of employees
500 new jobs
Process Details:
Wafer size
200mm
Applications
Networking/computing systems, transportation and wireless/broadband systems
Test
Hot and cold temperature tests
Assembly
Automated process/equipment from flipchip die attach process to solder sphere reflow
Packaging
Jedec trays or Tape and Reel
