PROJECTS ARCHIVE
| Assembly | Compound Semiconductor |
| MEMS | Research |
| Silicon |
Top- ChipPAC Assembly and Test Facility, Shanghai, China
- Fairchild Assembly and Test Facility, Suzhou, China
- Motorola Flip-Chip and QFP Packaging and Testing Facility, Petaling, Malaysia
- Optoelectronics Packaging Centre, Livingstone, United Kingdom
- IQE III-V Semiconductor Facility, Cardiff, United Kingdom
- Osram Optoelectronics Chip Factory, Regensburg, Germany
- RF Micro Devices 6in Gallium Arsenide Wafer Fab, Greensboro, NC, USA
- Sumitomo Electric GaAs Wafer Plant, Hillsboro, OR, USA
- TDI GaN, AlN and AlGaN Epitaxial Wafer Fab, Silver Spring, MD, USA
- TriQuint Optoelectronics Fab, Matamoros, Mexico
- Ulm Photonics VCSEL Fab, Ulm, Germany
- NanoFab II 300mm Research Fabs, Albany University, NY, USA
- Omron Keihanna Sensor and Control Technology Innovation Center, Japan
- ASMC 200mm CMOS Wafer Fab, Shanghai, China
- Fujitsu 90nm LSI Pilot Production, Akiruno, Japan
- IBM 300mm CMOS Fab, East Fishkill, NY, USA
- Infineon Technologies 300mm CMOS Fab, Dresden, Germany
- Micron 300mm DRAM Pilot Line, Manassas, VA, USA
- Soitec Bernin II 300mm SOI (Silicon on Insulator) Wafer Fab, France
- Texas Instruments DMOS6 300mm Expansion, Dallas, TX, USA
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