Key Data:
Type of facility (technologies)
SOI wafers
Area
4,500m² Class 1 cleanroom
Target completion
The fab is now ramping up to full production.
Number of employees
Around 400
Process Details:
Throughput
1,200 annual wafer starts/year (200mm equivalents)
Applications
High speed/low power logic, microprocessors, memories, automotive, computing, aerospace, medical, optoelectronics and consumer equipment