EV Group Wafer Processing Equipment
EV Group (EVG) is a recognised technology company and a market leader for wafer processing equipment.
The company manufactures industry-leading wafer-bonding, lithography / nanoimprint lithography (NIL), metrology, photo-resistant coating, cleaning and inspection equipment.
EVG targets the advanced packaging, compound semiconductor / LED and silicon-based power devices, micro-electro-mechanical systems (MEMS), nanotechnology and silicon-on-insulator (SOI) markets.
Wafer bonding, advanced packaging and nanotechnology
EVG has set worldwide industry standards for aligned wafer bonding, as well as resist processing for the MEMS, nanotechnology and semiconductor industries. In fact, EVG holds the dominant share of the market for wafer bonding equipment and is a market and technology leader in lithography for advanced packaging and nanotechnology.
Through close collaboration with its global customers, the company implements a flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines.
R&D and high-volume production expertise
A long history of innovation, superior process capabilities and advanced, cost-effective production equipment, as well as quality and support, make EVG the partner of choice, both in R&D and high-volume production environments. EVG’s technological expertise and cooperative relationships with an extensive list of global partners enables customers to develop and successfully commercialise their innovations.
EVG works closely with universities, as well as industry related and independent R&D institutes, and plays a major role in numerous industry consortia. Along these lines, the company co-founded the EMC-3D consortium to create and help drive implementation of a cost-effective through-silicon via (TSV) process for 3D chip stacking and MEMS integration.
EVG also founded NILCom, a consortium of imprint lithography supply chain companies and research organisations working together to assist clients in advancing their ideas into a manufacturing environment.
Advanced process development and application labs
Founded in 1980, EVG is headquartered in St Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; Seoul, Korea, and Chung-Li, Taiwan.
The company’s unique triple i-approach (invent, innovate, implement) is supported by a vertical integration, allowing EVG to respond quickly to new technological developments, apply new technology to manufacturing challenges and to expedite device manufacturing at a high volume.
With state-of-the-art application labs and cleanroom facilities based at its headquarters in Austria, as well as in the US and Japan, EVG is focused on delivering superior process expertise to its growing global customer base.
In addition these advanced process development and application labs are designed to accommodate independent research work, which will explore and develop baseline processes and conduct small volume pilot line runs in order to simulate a production line process.
Products and Services
DI Erich Thallner Strasse 1
St Florian am Inn
Yokohama Business Park East Tower 1F
134, Godo-cho, Hodogaya-ku
Room 302, 3rd Floor, ILJIN Building
97-4 BanPo-Dong, SeoCho-Gu
7700 South River Parkway
United States of America
255 Fuller Road
PO Box # 294
United States of America
10F-7, No. 400, Hwang-Pei Road