<p>High utilisation has returned to the semiconductor manufacturing industry, and with it, all the challenges
associated with achieving the most output at lowest cost. Tool-based approaches focus on solutions that
improve tool unit output (wafers/day) through excursion control, process control (Cpk), and throughput
enhancements. Fab-wide approaches focus on using automation to improve throughput and optimise cycle time. In this
article, we survey both approaches, and offer our insight into future trends.</p>
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