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IBM 300mm CMOS Fab, East Fishkill, NY

Organization

IBM Microelectronics

Location

East Fishkill

Type of facility (technologies)

300mm CMOS

Project cost

$2.5 billion

Area

14,000m²

Target completion

Now ramping up

No of employees

1,000 extra

Wafer size

300mm

Feature size

90nm

Throughput

500-600 wafers/day

Applications

Many, from mainframes, servers and supercomputers to cellular phones and home game consoles.
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Project Overview



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