Semiconductor Technology is using cookies

We use them to give you the best experience. If you continue using our website, we'll assume that you are happy to receive all cookies on this website.

ContinueLearn More X
X

Infineon Technologies 300mm CMOS Fab

Organisation

Infineon Technologies AG

Location

Dresden

Type of facility (technologies)

CMOS

Project cost

€1.1 billion

Area

Set in 260,000m²

Target completion

Ramp up to full production end 2003

No of employees

1,700 total on the Dresden 300mm lines

Wafer size

300mm

Feature size

140nm and below

Throughput

28,000 wafer starts per month

Applications

Servers, workstations, PCs and notebooks
Expand

Project Overview



Related Articles

Go Top