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Motorola Flip-Chip and QFP Packaging

Organization

Motorola Inc

Location

Petaling Jaya, Malaysia

Type of facility (technologies)

Assembly and test: CMOS microprocessors, CMOS logic, CMOS memory, Bi-CMOS, GaAs

Project cost

$16 million

Area

Adds more than 9,000m² of manufacturing area to the existing 70,000m² on an eight hectare site

Target completion

August 2002

No of employees

500 new jobs

Wafer size

200mm

Applications

Networking/computing systems, transportation and wireless/broadband systems

Test

Hot and cold temperature tests

Assembly

Automated process/equipment from flipchip die attach process to solder sphere reflow

Packaging

Jedec trays or Tape and Reel
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Project Overview



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