Optoelectronics Packaging Centre

Siconnex provides surface preparation equipment and processes, including wet batch wafer spray and single wafer spray systems for the III-V semiconductor, micro-electro-mechanical systems (MEMS), wireless, power, energy harvesting, wafer-level package (WLP), data storage and logic industries.

Unisem Group is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies.