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Soitec Bernin II 300mm SOI (Silicon on Insulator)

Organization

Soitec

Location

Bernin II

Type of facility (technologies)

SOI wafers

Area

4,500m² Class 1 cleanroom

Target completion

The fab is now ramping up to full production.

Number of employees

Around 400

Wafer size

Up to 300mm

Throughput

1,200 annual wafer starts/year (200mm equivalents)

Applications

High speed/low power logic, microprocessors, memories, automotive, computing, aerospace, medical, optoelectronics and consumer equipment
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Project Overview



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