Assembly
| ChipPAC | ||
ChipPAC assembly and test foundry, Shanghai, China. |
ChipPAC is more than doubling its capacity at Shanghai. |
The ChipPAC facility will be over 30,000m2. |
Leaded packages include the iQuad(1) with up to 208 leads. |
ChipPAC has already invested over $150 million in manufacturing capabilities in China. |
The new fab should produce over ten million units per day. |
ChipPAC aims to become a logistics and distribution hub for semiconductor companies wanting to do business in China. |
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| Fairchild Assembly and Test Facility, Suzhou | ||
Fairchild (HQ shown) has completed construction of the first phase of its assembly, test and warehouse facility in Suzhou. |
The Suzhou facility concentrates on products optimizing system power in multiple end markets. |
Fairchild's power semiconductor range. |
Fairchild's power devices for DC/DC conversion include DC/DC converters, PWM controllers, optocouplers, and bridge rectifiers. |
Operator at Fairchild's Korean facility. |
Operator at Fairchild's Cebu (Philippines) facility. |
The Suzhou facility is initially manufacturing the company's latest power devices. |
Fairchild power device on printed circuit board. |
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| Motorola Flip-Chip and QFP Packaging | ||
Engineer attending to Micron machine (pick and place of die to substrate). |
Tray with Apollo material (29 x 29 pkg). |
Pick and Place (transferring dice from mylar to waffle packs). |
Units after fluxing, on pallets being transported for die attach (pick and place). |
PBGA-quartz material. |
Fluxer. |
Pick and place of completed units, after sphere attach. |
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| National Semiconductor Analog Assembly | ||
National Semiconductor's worldwide headquarters in Santa Clara (California, USA). |
National Semiconductor's Global Distribution Center, Singapore. |
Wafer handling at a 1,200ºC furnace. |
Automated manufacturing at National's Singapore assembly and test facility. |
Checking for defects on a die. |
National's Singapore assembly and test facility employs about 2,000 people. |
The micro SMD packaging are smaller than chip capacitors and can dramatically cut pc board sizes. |
Electron-microscope view of chip-scale micro SMD device, showing spherical solder bumps (x60). |
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| Nokia Mobile Phone Production Facility, | ||
Nokia has chosen Chennai, Southern India, for its tenth mobile phone factory. |
Nokia's 6235 captures and views images with an integrated VGA camera and video recorder. |
The Nokia 9500 communicator offers 80MB high capacity, plus a MultiMediaCard(MMC) slot. |
Nokia's regional corporate headquarters are located at Alexandra Technopark in Singapore. |
Nokia is expanding mobile voice and data capabilities across its mobile devices. |
The world's mobile subscriber base is now running at around two billion. |
Nokia will add about 2,000 employees to its workforce at Chennai. |
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| Optoelectronics Packaging Centre, | ||
A facility to develop new packages for optoelectronic devices will be located in Livingston, Scotland, in Summer 2003. |
The Cadence Building in the Alba Centre (a Scottish Enterprise Network Initative) at Livingston. |
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