Wafer Fabrication
| ASML | ||
ASML is the world's leading provider of lithography systems for the semiconductor industry. |
ASML also offers process solutions to help customers seamlessly integrate every step in their chipmaking. |
ASML technology transfers circuit patterns onto silicon wafers to make every kind of chip used today. |
HydroLith immersion technology provides greater productivity for our customers. |
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| Aurion | ||
KIVOS 750 RIE, equipped with five drawers (electrodes) for high loading capacity. |
PIKNOS 30 MW, Aurion´s microwave downstream plasma system. |
Circular electrode of the CYLOS RIE system. |
Matchbox PRODIK-T 160 for 160 Amps output current. |
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| Axus Technology | ||
The IPEC 472 CMP tool provides a flexible production and research platform for 75mm to 200mm substrates. |
The Strasbaugh 7AF is an automated wafer grinder handling wafers up to 200mm in diameter. |
Axus Technology maintains an extensive inventory of parts for tools such as the SpeedFam Auriga and SpeedFam Auriga C. |
The Strasbaugh 7AA wafer grinder can be upgraded to thin a range of either common or unique materials. |
Axus Technology provides service support, upgrades, and material for systems such as the IPEC 776. |
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| Equipment Acquisition Resources | ||
EAR's new ARW 300N2 rotary wire saw for dry cut and wet cut wire sawing. |
Lapping equipment includes Speedfam, Hoffman, Spitfire and Peter Wolters double-sided and single-sided lappers, Hyprez lappers and Crane Lapmasters. Grinding equipment and related systems include Strasbaugh fully automatic backgrinders, edge grinders and profilers. |
E.A.R. offers a wide range of dicing saws: Disco dicing saws; K+S dicing saws; Microautomation dicing saws; MTI dicing saws and TSK dicing saws. |
In the field of polishing equipment, we offer Speedfam double-sided and single-sided polishers (above); as well as LOH polishers, Beuhler polishers, Crane polishers and Logitech polishers. |
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| Reinraumtechnik Lanz | ||
Substrate spinner EBS 11 for coating respectively developing substrates and wafers. Ready for table build-in. |
Hotplate HP 200 for baking and tempering substrates and wafers. Maximum temperature is 200°C. |
HMDS oven VPO 50 is designed for dehydration and vapor deposition to generate photo resist adhesion. |
Reinraumtechnik's range of refurbished Karl Suss (Suss Microtec) mask aligners includes the MA 150, MA56, MA 45, MJB3 models. |
Our Customized BAK 550 evaporator / high vacuum coater. |
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| SEZ Group | ||
SEZ's award-winning Da Vinci™ series – which delivers advanced process technology for bevel-edge, front side, backside and double-sided applications – pioneered and subsequently dominated the shift to BEOL single-wafer wet processing. |
SEZ’s industry acclaimed Da Vinci Series of single-wafer spin processors provides a double-side process module in their existing line of tools, which enables the simultaneous removal of wafer front-side polymers and backside defects. |
SEZ is once again leading the single-wafer conversion for FEOL cleaning and stripping applications with Esanti – its evolutionary new single-wafer wet-processing technology platform. |
| STS | ||
STS manufactures a range of plasma etch and deposition systems used in the production of semiconductor related devices. |
STS offers flexible platform options for easy transition from R&D to high volume production. |
STS is a market leader in deep silicon etching for MEMS with its Advanced Silicon Etch (ASE®) process. |
STS has a wide range of etch processes for compound semiconductor materials such as GaAs via etch. |
STS supplies equipment for precision etching of doped and undoped cores and PECVD of clad layers for optional waveguides. Courtesy of Wavesplitter Technologies, Inc. |
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| TESAG | ||
TESAG, a pure-play compound semiconductor epitaxial wafer foundry, brings a huge experience in MOVPE (Metal-Organic Vapor Phase Epitaxy) for III / V devices to the marketplace. |
Bragg reflector. TESAG offers a high precision in the emission wavelength with excellent homogeneity over the wafer, which is particularly decisive for laser diode and laser bar applications. |
Red LED wafer. TESAG has successfully worked with customers, tailoring LED epiwafers for their specific requirements for sensing, medical and telecommunication applications. |
Loading of an AIX 2600G3 reactor - the platform for TESAG's mass production of 2in, 3in, 4in and 6in wafers. |
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| Vistec Electron Beam | ||
The Vistec SB3050 series electron-beam lithography system is designed to meet the challenges of direct-write patterning for research and development, and prototypes to the 32mm technology node and below. |
The Vistec SB3050 ensures full 300mm wafer-exposure capability. |
Vistec SB250 series electron-beam lithography writers are designed as universal and cost-effective tools for both direct-write and mask-making applications, and allow customers to react flexibly to market demands. |
