Wafer Fabrication


SEZ's award-winning Da Vinci™ series – which delivers advanced process technology for bevel-edge, front side, backside and double-sided applications – pioneered and subsequently dominated the shift to BEOL single-wafer wet processing.

SEZ’s industry acclaimed Da Vinci Series of single-wafer spin processors provides a double-side process module in their existing line of tools, which enables the simultaneous removal of wafer front-side polymers and backside defects.

SEZ is once again leading the single-wafer conversion for FEOL cleaning and stripping applications with Esanti – its evolutionary new single-wafer wet-processing technology platform.


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